LQH32DN4R7M53L Datasheet LQH32DN3R3M53L, 350-80-131-00-006101, LQH32DN220K53L | P1-P3

SpecNo.JELF243A-0118A-01 P1/7

MURATA MFG.CO., LTD

Reference Only

CHIP COIL（CHIP INDUCTORS） LQH32DN□□□□53L REFERENCE SPECIFICATION

1.Scope

This reference specification applies to LQH32DN_53 Series, Chip coil (Chip Inductors).

2.Part Numbering

(ex) LQ H 32 D N 1R0 M 5 3 L

Product ID

Structure

Dimension

Applications Category Inductance Tolerance Features

Electrode Packaging

(L×W)

and (For Automotive)

L:Taping

Characteristics

3.Rating

Operating Temperature Range. -40 to +105°C

Storage Temperature Range. -40

to +105°C

Customer

Part Number

MURATA

Part Number

Inductance

Resistance

(Ω)

Self

Resonant

Frequency

(MHz min)

∗Rated

Current

(mA)

(µH) Tolerance

LQH32DN1R0M53L 1.0

M:±20%

0.060±30% 100 1000

LQH32DN2R2M53L 2.2 0.097±30% 64 790

LQH32DN3R3M53L 3.3 0.12±30% 50 710

LQH32DN4R7M53L 4.7 0.15±30% 43 650

LQH32DN6R8M53L 6.8 0.25±30% 32 540

LQH32DN100K53L 10

K:±10%

0.30±30% 26 450

LQH32DN150K53L 15 0.58±30% 26 300

LQH32DN220K53L 22 0.71±30% 19 250

LQH32DN330K53L 33 1.1±30% 17 200

LQH32DN470K53L 47 1.3±30% 15 170

LQH32DN680K53L 68 2.2±30% 12 130

LQH32DN101K53L 100 3.5±30% 10 100

∗When applied Rated current to the Products , self temperature rise shall be limited to 20 max and Inductance ℃

will be within ±10% of initial Inductance value.

4.Testing Conditions

Temperature

: Ordinary Temperature (15 to 35°C) Temperature : 20 ± 2°C

Humidity

: Ordinary Humidity (25 to 85 %(RH)) Humidity : 60 to 70 %(RH)

Atmospheric Pressure : 86 to 106 kPa

5.Appearance and Dimensions

■Unit Mass (Typical value)

0.045ｇ

(in mm)

2.5 ± 0.2

1.55 ± 0.15

3.2 ± 0.3

0.9 ± 0.31.3 ± 0.2 0.9 ± 0.3

A:2.8max.

※

No marking.

SpecNo.JELF243A-0118A-01 P2/7

MURATA MFG.CO., LTD

Reference Only

6.Electrical Performance

No. Item Specification Test Method

6.1 Inductance Inductance shall meet item 3. Measuring Equipment : KEYSIGHT 4192A or equivalent

Measuring Frequency: 1MHz

6.2 DC Resistance DC Resistance shall meet item 3. Measuring Equipment:Digital multi meter

6.3 Self Resonant

Frequency

(S.R.F)

S.R.F shall meet item 3. Measuring Equipment : KEYSIGHT E4991A or equivalent

7.Mechanical Performance

No. Item Specification Test Method

7.1 Shear Test Chip coil shall not be damaged. Substrate:Glass-epoxy substrate

Applied Direction :

Force:10N

Hold Duration:5±1s

7.2 Bending Test Substrate:Glass-epoxy substrate (100×40×1.6mm)

Speed of Applying Force:1mm / s

Deflection:2mm

Hold Duration:5s

(in mm)

7.3 Vibration Oscillation Frequency : 10Hz~55Hz~10Hz

for 1 minute

Total amplitude 1.5 mm

Testing Time:A period of 2 hours in each of 3 mutually

perpendicular directions. (Total 6 hours)

7.4

Solderability The wetting area of the electrode

shall be at least 90% covered with

new solder coating.

Flux:Ethanol solution of rosin,25(wt)%

(Immersed for 5s to 10s)

Solder : Sn-3.0Ag-0.5Cu

Pre-Heating: 150±10°C / 60 to 90seconds

Solder Temperature:240±5°C

Immersion Time: 3±1 s

Ｆ

Chip coil

Substrate

R230

Deflection

Product

Pressure jig

SpecNo.JELF243A-0118A-01 P3/7

MURATA MFG.CO., LTD

Reference Only

8.Environmental Performance (It shall be soldered on the substrate)

No. Item Specification Test Method

8.1

Heat Resistance Appearance:No damage

Inductance Change: within ± 5%

DC Resistance Change:

within ± 5%

Temperature:105±2°C

Time: 1000h (+48h , -0h)

Then measured after exposure in the

room condition for 24±2 hours.

8.2

Cold Resistance Temperature:-40±2°C

Time: 1000h (+48h , -0h)

Then measured after exposure in the

room condition for 24±2 hours.

8.3

Humidity Temperature:85±2°C

Humidity:80~85%(RH)

Time: 1000h (+48h , -0h)

Then measured after exposure in the

room condition for 24±2 hours.

8.4

Temperature

Cycle

1 cycle:

1 step: -40±2°C / 30±3 minutes

2 step:Ordinary temp. / 5 minutes min

3 step:+105±2°C / 30±3 min

4 step: Ordinary temp. / 10 to 15 minutes min

Total of 100cycles

Then measured after exposure in the room

condition for 24±2 hours

9.Specification of Packaging

9.1 Appearance and Dimensions of plastic tape

(in mm)

9.2 Specification of Taping

(1) Packing quantity (standard quantity)

2,000 pcs / reel

(2) Packing Method

Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.

(3) Sprocket hole

The sprocket holes are to the right as the tape is pulled toward the user.

(4) Spliced point

Plastic tape and Cover tape has no spliced point.

(5) Missing components number

Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater,

and are not continuous. The specified quantity per reel is kept.

9.3 Pull Strength

Embossed carrier tape 10N min.

Cover tape 5N min.

9.4 Peeling off force of cover tape

Speed of Peeling off 300mm/min

Peeling off force

0.2 to 0.7N

(minimum value is typical)

165 to 180 degree

Cover tape

Plastic tape

Dimension of the Cavity is measured

at the bottom side.

2.9±0.2

2.0±0.05

4.0±0.1

Direction of feed

※

Lead- in/out wire

4.0±0.1

3.6±0.2

8.0±0.2

1.75±0.13.5±0.05

1.5

-0

+0.1

1.7±0.2

0.2

※

The packing directions of the chip coil

in taping are unified with the in/out

positions of the lead wire.

(0.2)

P1-P3 P4-P6 P7-P7

LQH32DN4R7M53L

Mfr. #:

Buy LQH32DN4R7M53L

Manufacturer:

Murata Electronics

Description:

Fixed Inductors 1210 4.7uH 20% 650mA 0.13ohms 43MHz(SRF)

Lifecycle:

New from this manufacturer.

Delivery:

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Payment:

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LQH32DN4R7M53L

LQH32DN4R7M53L

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