LQH32DN4R7M53L

SpecNo.JELF243A-0118A-01 P4/7
MURATA MFG.CO., LTD
Reference Only
9.5 Dimensions of Leader-tape,Trailer and Reel
There shall be leader-tape ( cover tape) and trailer-tape (empty tape) as follows
9.6 Marking for reel
Customer part number, MURATA part number, Inspection number(1), RoHS marking(2), Quantity etc ・・・
1) <Expression of Inspection No.> □□ OOOO ×××
(1) (2) (3)
(1) Factory Code
(2) Date First digit : Year / Last digit of year
Second digit
: Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
Third, Fourth digit : Day
(3) Serial No.
2) « Expression of RoHS marking » ROHS – Y
()
(1) (2)
(1) RoHS regulation conformity
(2) MURATA classification number
9.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS marking (2) ,Quantity, etc ・・・
9.8 Specification of Outer Case
Outer Case Dimensions (mm)
Standard Reel Quantity
in Outer Case (Reel)
W D H
186 186 93 5
Above Outer Case size is typical. It depends on a quantity of an order.
10. Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability for
the prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment
(6) Transportation equipment (vehicles, trains, ships, etc.)
(2) Aerospace equipment (7) Traffic signal equipment
(3) Undersea equipment
(8) Disaster prevention / crime prevention equipment
(4) Power plant control equipment (9) Data-processing equipment
(5) Medical equipment
(10) Applications of similar complexity and /or reliability requirements
to the applications listed in the above
Empty tape
190 min.
Leader
Trailer
Cover tape
2.0±0.5
φ
13.0±0.2
φ
21.0±0.8
φ
180±
φ
60±
13±1.4
1
0
0
3
Direction of feed
210 mi n.
160 min.
1
0
Label
W
D
Label
H
SpecNo.JELF243A-0118A-01 P5/7
MURATA MFG.CO., LTD
Reference Only
11. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
11.1 Land pattern designing
Recommended land patterns for flow and reflow soldering are as follows:
These have been designed for Electric characteristics and solderability.
Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or
solderability may be affected, or result to "position shift" in soldering process.
Reflow Soldering
(in mm)
11.2 Flux, Solder
Flux
Use rosin-based flux.
Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).
Don’t use water-soluble flux.
Solder
Use Sn-3.0Ag-0.5Cu solder
Standard thickness of solder paste : 200μm to 300μm
Other flux (except above) Please contact us for details, then use.
11.3 Reflow soldering conditions
Pre-heating should be in such a way that the temperature difference between solder and product surface is limited
to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is
limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration
of product quality.
Soldering profile
Standard Profile Limit Profile
Pre-heating 150180°C 90s±30s
Heating above 220°C30s60s above 230°C60s max.
Peak temperature 245±3°C 260°C
Cycle of reflow 2 times 2 times
5.5
1.0
2.0
1.0 1.3 1.0
Limit Profile
Standard Profile
90s±30s
230
260℃
245±3
220
30s~60s
60s max.
180
150
Temp.
(s)
(℃)
Time.
SpecNo.JELF243A-0118A-01 P6/7
MURATA MFG.CO., LTD
Reference Only
11.4 Reworking with soldering iron.
The following conditions must be strictly followed when using a soldering iron.
Pre-heating 150°C,1 min
Tip temperature 350°C max.
Soldering iron output 80W max.
Tip diameter φ3mm max.
Soldering time 3(+1,-0)s
Times 2 times
Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack
on the products due to the thermal shock.
11.5 Solder Volume
Solder shall be used not to be exceeded the upper limits as shown below.
Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
1/3T t T
(T: Lower flange thickness)
11.6 Product's location
The following shall be considered when designing and laying out P.C.B.’s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.
Products direction
Products shall be located in the sideways
direction (Length:a<b) to the mechanical stress.
(2) Products location on P.C.B. separation
Products (A,B,C,D) shall be located carefully
so that products are not subject to the
mechanical stress due to warping the board.
Because they may be subjected the mechanical
stress in order of A>C>B D.
11.7 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon
at the mounted products and P.C.B.
Power : 20 W / l max. Frequency : 28kHz to 40kHz Time : 5 minutes max.
(3) Cleaner
1. Alternative cleaner
Isopropyl alcohol (IPA)
2. Aqueous agent
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized
water in order to remove the cleaner.
(5) Other cleaning
Please contact us.
Upper Limit
Recommendable
T
t
Poor example
Good example
b
a
Seam
Slit
A
D
B
C
b
a
Length:a
<
b

LQH32DN4R7M53L

Mfr. #:
Manufacturer:
Murata Electronics
Description:
Fixed Inductors 1210 4.7uH 20% 650mA 0.13ohms 43MHz(SRF)
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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