Spec No. JELF243B-0003R-01 P.5/8
MURATA MFG.CO., LTD
Reference
Only
9.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS
Marking (2), Quantity, etc ･･･
9.8. Specification of Outer Case
Outer Case Dimensions
(mm)
Standard Reel Quantity
in Outer Case (Reel)
W D H
186 186 93 5
Above Outer Case size is typical. It depends on a quantity of an order.
10. ！ Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially
high reliability for the prevention of defects which might directly cause damage to the third party's life,
body or property.
(1) Aircraft equipment (6) Transportation equipment (vehicles, trains, ships, etc.)
(2) Aerospace equipment
(7) Traffic signal equipment
(3) Undersea equipment (8) Disaster prevention / crime prevention equipment
(4) Power plant control equipment (9) Data-processing equipment
(5) Medical equipment (10) Applications of similar complexity and /or reliability
requirements to the applications listed in the above
11. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
11.1 Land pattern designing
Soldering a b c
Flow
0.7
2.2 to 2.6
0.7
Reflow 1.8 to 2.0
(in mm)
11.2 Flux, Solder
・ Use rosin-based flux.
Don’t use highly acidic flux with halide content exceeding 0.2(wt) % (chlorine conversion value).
Don’t use water-soluble flux.
・ Use Sn-3.0Ag-0.5Cu solder.
・ Standard thickness of solder paste:100μm to 150μm.
11.3 Flow soldering / Reflow soldering conditions
・Pre-heating should be in such a way that the temperature difference between solder and product
surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the
temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products
quality.
・Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the
deterioration of product quality.
a
b
Chip Coil
Land
Solder Resist
c
W
D
Label
H
