PTFA043002E V1 Datasheet PTFA043002E V1 | P7-P9

PTFA043002E

Data Sheet 7 of 10 Rev. 03.1, 2009-02-20

a043002e_cd-dtl_0702212

R12

QQ1

R14

R10

R11

R13

C35

C33

C10 C12

C34

VDD

C11

a043002e_cd-02_070212

RF_OUT

VDD

RF_IN

R12

QQ1

R8R7

R14

R10

R11

C6 C8

R13

C35

C33

C10

C12

C34

C13

C17

C15

C16

C31

C32

C29

C25

C26

C24

C19

C20

C18

C21

C23

C22

C28

C27

VDD

C14

C30

C11

Reference circuit assembly diagram* (not to scale)—rated for 300 W (PEP) only

Reference Circuit (cont.)

*Gerber Files for this circuit available on request.

PTFA043002E

Data Sheet 8 of 10 Rev. 03.1, 2009-02-20

Reference Circuit (cont.)

Component Description Suggested Manufacturer P/N or Comment

C1, C32 Ceramic capacitor, 2.7 pF ATC 100B 2R7

C2 Capacitor, 15 pF ATC 100B 150

C3, C8, C9, C12, Ceramic capacitor, 75 pF ATC 100B 750

C16, C17, C18, C24

C4, C15 Ceramic capacitor, 2.4 pF ATC 100B 2R4

C5, C13 Ceramic capacitor, 8.2 pF ATC 100B 8R2

C6, C10 Capacitor, 0.1 µF Digi-Key PCC104BCT-ND

C7, C11 Tantalum capacitor, 10 µF, 35 V Digi-Key PCS6106TR-ND

C14 Ceramic capacitor, 4.8 pF ATC 100B 4R8

C19, C20, C25, C26 Capacitor, 1 µF ATC 920C105

C21, C22, C27, C28 Tantalum capacitor, 10 µF, 50 V Garrett Electronics TPS106K050R0400

C23, C29 Ceramic capacitor, 0.01 µF ATC 200B 103

C30 Ceramic capacitor, 6.8 pF ATC 100B 6R8

C31 Ceramic capacitor, 6.2 pF ATC 100B 6R2

C33, C34, C35 Capacitor, 0.001 µF Digi-Key PCC1772CT-ND

L1, L2 Ferrite, 8.9 mm Elna Magnetics BDS 4.6/3/8.9-4S2

Q1 Transistor Infineon Technologies BCP56

QQ1 Voltage regulator National Semiconductor LM7805

R1, R14 Chip Resistor 100 ohms Digi-Key P100ECT-ND

R2, R13 Potentiometer 2 k-ohms Digi-Key 3224W-202ETR-ND

R3, R12 Chip Resistor 22 ohms Digi-Key P22KECT-ND

R4, R7 Chip Resistor 3.3 k-ohms Digi-Key P3.3KECT-ND

R5, R8 Chip Resistor 10 ohms Digi-Key P10ECT-ND

R6, R9 Chip Resistor 5.1 k-ohms Digi-Key P5.1KECT-ND

R10 Chip Resistor 1.0 k-ohms Digi-Key P1KGCT-ND

R11 Chip Resistor 1.1 k-ohms Digi-Key P1.1KGCT-ND

See next page for package information

PTFA043002E

Data Sheet 9 of 10 Rev. 03.1, 2009-02-20

41.15

[1.620]

1.63

[.064]

2.18

[.086] SPH

31.24±0.28

[1.230±.011]

35.56

[1.400]

16.61±0.51

[.654±.020]

2X R 1.59

[.063]

2X 3.18

[.125]

9.40

[.370 ]

0.038 [.0015]

-A-

2X 45°±5° X 1.19

[.047]

4.55±0.38

[.179±.015]

Flange 10.16

[.400]

4X 3.23±0.25

[.127±.010]

H-30275-4

[.360 ]

+.004

–.006

LID 9.14

+0.10

–0.15

4X 11.68

[.460]

13.72

[.540]

+0.10

–0.15

+.004

–.006

Package Outline Specifications

Package H-30275-4

Diagram Notes—unless otherwise specified:

1. Lead thickness: 0.13 +0.051/–0.025 [.005 +.002/–.001].

2. All tolerances ± 0.127 [.005] unless specified otherwise.

3. Pins: D = drain, S = source, G = gate.

4. Interpret dimensions and tolerances per ASME Y14.5M-1994.

5. Primary dimensions are mm. Alternate dimensions are inches.

6. Gold plating thickness:

S - flange: 2.54 micron [100 microinch] (min)

D, G - leads: 11.14 micron ± 0.38 micron [45 microinch ± 15 microinch]

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PTFA043002E V1

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RF MOSFET Transistors RFP-LDMOS GOLDMOS 8

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PTFA043002E V1