LT3009 Series
13
3009fd
be implemented to prevent board contamination. If the
board is to be subjected to humidity cycling or if board
cleaning measures cannot be guaranteed, consideration
should be given to using resistors an order of magnitude
smaller than in Table 1 to prevent contamination from
causing unwanted shifts in the output voltage.
Output Capacitance and Transient Response
The LT3009 is stable with a wide range of output capaci-
tors. The ESR of the output capacitor affects stability, most
notably with small capacitors. Use a minimum output
capacitor of 1μF with an ESR of 3 or less to prevent os-
cillations. The LT3009 is a micropower device and output
load transient response is a function of output capacitance.
Larger values of output capacitance decrease the peak
deviations and provide improved transient response for
larger load current changes.
Give extra consideration to the use of ceramic capacitors.
Manufacturers make ceramic capacitors with a variety of
dielectrics, each with different behavior across tempera-
ture and applied voltage. The most common dielectrics
APPLICATIONS INFORMATION
DC BIAS VOLTAGE (V)
CHANGE IN VALUE (%)
3009 F02
20
0
–20
–40
–60
–80
–100
0
4
8
10
26
12
14
X5R
Y5V
16
BOTH CAPACITORS ARE 16V,
1210 CASE SIZE, 10μF
TEMPERATURE (°C)
–50
40
20
0
–20
–40
–60
–80
–100
25 75
3009 F03
–25 0
50 100 125
Y5V
CHANGE IN VALUE (%)
X5R
BOTH CAPACITORS ARE 16V,
1210 CASE SIZE, 10μF
Figure 2. Ceramic Capacitor DC Bias Characteristics Figure 3. Ceramic Capacitor Temperature Characteristics
are specifi ed with EIA temperature characteristic codes
of Z5U, Y5V, X5R and X7R. The Z5U and Y5V dielectrics
provide high C-V products in a small package at low cost,
but exhibit strong voltage and temperature coeffi cients as
shown in Figures 2 and 3. When used with a 5V regulator,
a 16V 10μF Y5V capacitor can exhibit an effective value
as low as 1μF to 2μF for the DC bias voltage applied and
over the operating temperature range. The X5R and X7R
dielectrics yield more stable characteristics and are more
suitable for use as the output capacitor. The X7R type has
better stability across temperature, while the X5R is less
expensive and is available in higher values. One must still
exercise care when using X5R and X7R capacitors; the
X5R and X7R codes only specify operating temperature
range and maximum capacitance change over temperature.
Capacitance change due to DC bias with X5R and X7R
capacitors is better than Y5V and Z5U capacitors, but can
still be signifi cant enough to drop capacitor values below
appropriate levels. Capacitor DC bias characteristics tend
to improve as component case size increases, but expected
capacitance at operating voltage should be verifi ed.
LT3009 Series
14
3009fd
Figure 4. Noise Resulting from Tapping
on a Ceramic Capacitor
Voltage and temperature coeffi cients are not the only
sources of problems. Some ceramic capacitors have a
piezoelectric response. A piezoelectric device generates
voltage across its terminals due to mechanical stress,
similar to the way a piezoelectric accelerometer or micro-
phone works. For a ceramic capacitor, the stress can be
induced by vibrations in the system or thermal transients.
The resulting voltages produced can cause appreciable
amounts of noise, especially when a ceramic capacitor is
used for noise bypassing. A ceramic capacitor produced
Figure 4’s trace in response to light tapping from a pencil.
Similar vibration induced behavior can masquerade as
increased output voltage noise.
APPLICATIONS INFORMATION
Thermal Considerations
The LT3009’s maximum rated junction temperature of
125°C limits its power-handling capability. Two components
comprise the power dissipated by the device:
1. Output current multiplied by the input/output voltage
differential: I
OUT
• (V
IN
– V
OUT
)
2. GND pin current multiplied by the input voltage:
I
GND
• V
IN
GND pin current is found by examining the GND Pin Cur-
rent curves in the Typical Performance Characteristics
section. Power dissipation equals the sum of the two
components listed prior.
The LT3009 regulator has internal thermal limiting designed
to protect the device during overload conditions. For con-
tinuous normal conditions, do not exceed the maximum
junction temperature rating of 125°C. Carefully consider
all sources of thermal resistance from junction to ambi-
ent including other heat sources mounted in proximity to
the LT3009. For surface mount devices, heat sinking is
accomplished by using the heat spreading capabilities of
the PC board and its copper traces. Copper board stiffeners
and plated through-holes can also be used to spread the
heat generated by power devices.
100ms/DIV
V
OUT
500μV/DIV
3009 F0
4
V
OUT
= 0.6V
C
OUT
= 22μF
I
LOAD
= 10μA
LT3009 Series
15
3009fd
The following tables list thermal resistance for several dif-
ferent board sizes and copper areas. All measurements
were taken in still air on 3/32" FR-4 board with one ounce
copper.
Calculating Junction Temperature
Example: Given an output voltage of 3.3V, an input volt-
age range of 12V ±5%, an output current range of 0mA
to 20mA and a maximum ambient temperature of 85°C,
what will the maximum junction temperature be for an
application using the DC package?
The power dissipated by the device is equal to:
I
OUT(MAX)
(V
IN(MAX)
– V
OUT
) + I
GND
(V
IN(MAX)
)
where,
I
OUT(MAX)
= 20mA
V
IN(MAX)
= 12.6V
I
GND
at (I
OUT
= 20mA, V
IN
= 12.6V) = 0.45mA
So,
P = 20mA(12.6V – 3.3V) + 0.45mA(12.6V) = 191.7mW
The thermal resistance will be in the range of 65°C/W to
85°C/W depending on the copper area. So the junction
temperature rise above ambient will be approximately
equal to:
0.1917W(75°C/W) = 14.4°C
The maximum junction temperature equals the maximum
junction temperature rise above ambient plus the maximum
ambient temperature or:
T
J(MAX)
= 85°C + 14.4°C = 99.4°C
Table 2: Measured Thermal Resistance for DC Package
COPPER AREA
BOARD
AREA
THERMAL RESISTANCE
(JUNCTION-TO-AMBIENT)TOPSIDE* BACKSIDE
2500mm
2
2500mm
2
2500mm
2
65°C/W
1000mm
2
2500mm
2
2500mm
2
70°C/W
225mm
2
2500mm
2
2500mm
2
75°C/W
100mm
2
2500mm
2
2500mm
2
80°C/W
50mm
2
2500mm
2
2500mm
2
85°C/W
*Device is mounted on the topside.
Table 3: Measured Thermal Resistance for SC70 Package
COPPER AREA
BOARD
AREA
THERMAL RESISTANCE
(JUNCTION-TO-AMBIENT)TOPSIDE* BACKSIDE
2500mm
2
2500mm
2
2500mm
2
75°C/W
1000mm
2
2500mm
2
2500mm
2
80°C/W
225mm
2
2500mm
2
2500mm
2
85°C/W
100mm
2
2500mm
2
2500mm
2
90°C/W
50mm
2
2500mm
2
2500mm
2
95°C/W
*Device is mounted on the topside.
APPLICATIONS INFORMATION

LT3009IDC-3.3#TRMPBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
LDO Voltage Regulators 20mA, 3uA Iq LDO Micropower Regulator
Lifecycle:
New from this manufacturer.
Delivery:
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