1. General description
The LPC2131/32/34/36/38 microcontrollers are based on a 16/32-bit ARM7TDMI-S CPU
with real-time emulation and embedded trace support, that combine the microcontroller
with 32 kB, 64 kB, 128 kB, 256 kB and 512 kB of embedded high-speed flash memory. A
128-bit wide memory interface and a unique accelerator architecture enable 32-bit code
execution at maximum clock rate. For critical code size applications, the alternative 16-bit
Thumb mode reduces code by more than 30 % with minimal performance penalty.
Due to their tiny size and low power consumption, these microcontrollers are ideal for
applications where miniaturization is a key requirement, such as access control and
point-of-sale. With a wide range of serial communications interfaces and on-chip SRAM
options of 8 kB, 16 kB, and 32 kB, they are very well suited for communication gateways
and protocol converters, soft modems, voice recognition and low-end imaging, providing
both large buffer size and high processing power. Various 32-bit timers, single or dual
10-bit 8-channel ADC(s), 10-bit DAC, PWM channels and 47 GPIO lines with up to nine
edge or level sensitive external interrupt pins make these microcontrollers particularly
suitable for industrial control and medical systems.
2. Features and benefits
2.1 Enhancements brought by LPC213x/01 devices
Fast GPIO ports enable port pin toggling up to 3.5 times faster than the original
LPC213x. They also allow for a port pin to be read at any time regardless of its
function.
Dedicated result registers for ADC(s) reduce interrupt overhead.
UART0/1 include fractional baud rate generator, auto-bauding capabilities and
handshake flow-control fully implemented in hardware.
Additional BOD control enables further reduction of power consumption.
2.2 Key features common for LPC213x and LPC213x/01
16/32-bit ARM7TDMI-S microcontroller in a tiny LQFP64 or HVQFN64 package.
8/16/32 kB of on-chip static RAM and 32/64/128/256/512 kB of on-chip flash program
memory. 128-bit wide interface/accelerator enables high-speed 60 MHz operation.
In-System Programming/In-Application Programming (ISP/IAP) via on-chip bootloader
software. Single flash sector or full chip erase in 400 ms and programming of 256 B in
1 ms.
EmbeddedICE RT and Embedded Trace interfaces offer real-time debugging with the
on-chip RealMonitor software and high-speed tracing of instruction execution.
LPC2131/32/34/36/38
Single-chip 16/32-bit microcontrollers; 32/64/128/256/512 kB
ISP/IAP flash with 10-bit ADC and DAC
Rev. 5.1 — 29 July 2011 Product data sheet
LPC2131_32_34_36_38 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 5.1 — 29 July 2011 2 of 45
NXP Semiconductors
LPC2131/32/34/36/38
Single-chip 16/32-bit microcontrollers
One (LPC2131/32) or two (LPC2134/36/38) 8-channel 10-bit ADCs provide a total of
up to 16 analog inputs, with conversion times as low as 2.44 s per channel.
Single 10-bit DAC provides variable analog output (LPC2132/34/36/38).
Two 32-bit timers/external event counters (with four capture and four compare
channels each), PWM unit (six outputs) and watchdog.
Low power Real-time clock with independent power and dedicated 32 kHz clock input.
Multiple serial interfaces including two UARTs (16C550), two Fast I
2
C-bus (400 kbit/s),
SPI and SSP with buffering and variable data length capabilities.
Vectored interrupt controller with configurable priorities and vector addresses.
Up to forty-seven 5 V tolerant general purpose I/O pins in tiny LQFP64 or HVQFN
package.
Up to nine edge or level sensitive external interrupt pins available.
60 MHz maximum CPU clock available from programmable on-chip PLL with settling
time of 100 s.
On-chip integrated oscillator operates with external crystal in range of 1 MHz to
30 MHz and with external oscillator up to 50 MHz.
Power saving modes include Idle and Power-down.
Individual enable/disable of peripheral functions as well as peripheral clock scaling
down for additional power optimization.
Processor wake-up from Power-down mode via external interrupt or BOD.
Single power supply chip with POR and BOD circuits:
CPU operating voltage range of 3.0 V to 3.6 V (3.3 V 10 %) with 5 V tolerant I/O
pads.
3. Ordering information
Table 1. Ordering information
Type number Package
Name Description Version
LPC2131FBD64/01 LQFP64 plastic low profile quad flat package; 64 leads;
body 10 10 1.4 mm
SOT314-2
LPC2132FBD64/01 LQFP64 plastic low profile quad flat package; 64 leads;
body 10 10 1.4 mm
SOT314-2
LPC2132FHN64/01 HVQFN64 plastic thermal enhanced very thin quad flat
package; no leads; 64 terminals; body
9 9 0.85 mm
SOT804-2
LPC2134FBD64/01 LQFP64 plastic low profile quad flat package; 64 leads;
body 10 10 1.4 mm
SOT314-2
LPC2136FBD64/01 LQFP64 plastic low profile quad flat package; 64 leads;
body 10 10 1.4 mm
SOT314-2
LPC2138FBD64/01 LQFP64 plastic low profile quad flat package; 64 leads;
body 10 10 1.4 mm
SOT314-2
LPC2138FHN64/01 HVQFN64 plastic thermal enhanced very thin quad flat
package; no leads; 64 terminals; body
9 9 0.85 mm
SOT804-2
LPC2131_32_34_36_38 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 5.1 — 29 July 2011 3 of 45
NXP Semiconductors
LPC2131/32/34/36/38
Single-chip 16/32-bit microcontrollers
3.1 Ordering options
Table 2. Ordering options
Type number Flash
memory
RAM ADC DAC Enhanced UARTs,
ADC, Fast I/Os, and
BOD
Temperature
range
LPC2131FBD64/01 32 kB 8 kB 1 - yes 40 C to +85 C
LPC2132FBD64/01 64 kB 16 kB 1 1 yes 40 C to +85 C
LPC2132FHN64/01 64 kB 16 kB 1 1 yes 40 C to +85 C
LPC2134FBD64/01 128 kB 16 kB 2 1 yes 40 C to +85 C
LPC2136FBD64/01 256 kB 32 kB 2 1 yes 40 C to +85 C
LPC2138FBD64/01 512 kB 32 kB 2 1 yes 40 C to +85 C
LPC2138FHN64/01 512 kB 32 kB 2 1 yes 40 C to +85 C

LPC2132FBD64,151

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
IC MCU 32BIT 64KB FLASH 64LQFP
Lifecycle:
New from this manufacturer.
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