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LPC2132FBD64,151

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P39P40-P42P43-P45
LPC2131_32_34_36_38 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 5.1 — 29 July 2011 25 of 45
NXP Semiconductors
LPC2131/32/34/36/38
Single-chip 16/32-bit microcontrollers
The ARM core has a Debug Communication Channel function built-in. The debug
communication channel allows a program running on the target to communicate with the
host debugger or another separate host without stopping the program flow or even
entering the debug state. The debug communication channel is accessed as a
co-processor 14 by the program running on the ARM7TDMI-S core. The debug
communication channel allows the JTAG port to be used for sending and receiving data
without affecting the normal program flow. The debug communication channel data and
control registers are mapped in to addresses in the EmbeddedICE logic.
6.19.2 Embedded trace
Since the LPC2131/32/34/36/38 have significant amounts of on-chip memory, it is not
possible to determine how the processor core is operating simply by observing the
external pins. The Embedded Trace Macrocell provides real-time trace capability for
deeply embedded processor cores. It outputs information about processor execution to
the trace port.
The ETM is connected directly to the ARM core and not to the main AMBA system bus. It
compresses the trace information and exports it through a narrow trace port. An external
trace port analyzer must capture the trace information under software debugger control.
Instruction trace (or PC trace) shows the flow of execution of the processor and provides a
list of all the instructions that were executed. Instruction trace is significantly compressed
by only broadcasting branch addresses as well as a set of status signals that indicate the
pipeline status on a cycle by cycle basis. Trace information generation can be controlled
by selecting the trigger resource. Trigger resources include address comparators,
counters and sequencers. Since trace information is compressed the software debugger
requires a static image of the code being executed. Self-modifying code can not be traced
because of this restriction.
6.19.3 RealMonitor
RealMonitor is a configurable software module, developed by ARM Inc., which enables
real time debug. It is a lightweight debug monitor that runs in the background while users
debug their foreground application. It communicates with the host using the DCC, which is
present in the EmbeddedICE logic. The LPC2131/32/34/36/38 contain a specific
configuration of RealMonitor software programmed into the on-chip flash memory.
LPC2131_32_34_36_38 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 5.1 — 29 July 2011 26 of 45
NXP Semiconductors
LPC2131/32/34/36/38
Single-chip 16/32-bit microcontrollers
7. Limiting values
[1] The following applies to the Limiting values:
a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated
maximum.
b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to V
SS
unless
otherwise noted.
[2] Including voltage on outputs in 3-state mode.
[3] Not to exceed 4.6 V.
[4] The peak current is limited to 25 times the corresponding maximum current.
[5] Dependent on package type.
[6] Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor.
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
Symbol Parameter Conditions Min Max Unit
V
DD
supply voltage (core and external rail) 0.5 +3.6 V
V
DDA
analog 3.3 V pad supply voltage 0.5 +4.6 V
V
i(VBAT)
input voltage on pin VBAT for the RTC 0.5 +4.6 V
V
i(VREF)
input voltage on pin VREF 0.5 +4.6 V
V
IA
analog input voltage on ADC related
pins
0.5 +5.1 V
V
I
input voltage 5 V tolerant I/O
pins; only valid
when the V
DD
supply voltage is
present
[2]
0.5 +6.0 V
other I/O pins
[2][3]
0.5 V
DD
+ 0.5 V
I
DD
supply current per supply pin
[4]
-100mA
I
SS
ground current per ground pin
[4]
-100mA
I
sink
sink current for I
2
C-bus; DC;
T = 85 C
-20 mA
T
stg
storage temperature
[5]
40 +125 C
P
tot(pack)
total power dissipation (per package) based on package
heat transfer, not
device power
consumption
-1.5W
V
ESD
electrostatic discharge voltage human body model
[6]
all pins 4000 +4000 V
LPC2131_32_34_36_38 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 5.1 — 29 July 2011 27 of 45
NXP Semiconductors
LPC2131/32/34/36/38
Single-chip 16/32-bit microcontrollers
8. Static characteristics
Table 6. Static characteristics
T
amb
=
40
C to +85
C for commercial applications, unless otherwise specified.
Symbol Parameter Conditions Min Typ
[1]
Max Unit
V
DD
supply voltage (core and
external rail)
3.0 3.3 3.6 V
V
DDA
analog 3.3 V pad supply
voltage
2.5 3.3 3.6 V
V
i(VBAT)
input voltage on pin VBAT
[2]
2.0 3.3 3.6 V
V
i(VREF)
input voltage on pin VREF 2.5 3.3 3.6 V
Standard port pins, RESET
, P1.26/RTCK
I
IL
LOW-level input current V
I
= 0 V; no pull-up - - 3 A
I
IH
HIGH-level input current V
I
=V
DD
; no-pull-down - - 3 A
I
OZ
OFF-state output current V
O
=0V; V
O
=V
DD
; no
pull-up/down
--3A
I
latch
I/O latch-up current (0.5V
DD
) < V
I
< (1.5V
DD
);
T
j
<125C
- - 100 mA
V
I
input voltage pin configured to provide a
digital function
[3][4][5]
[6]
0-5.5V
V
O
output voltage output active 0 - V
DD
V
V
IH
HIGH-level input voltage 2.0 - - V
V
IL
LOW-level input voltage - - 0.8 V
V
hys
hysteresis voltage 0.4 - - V
V
OH
HIGH-level output voltage I
OH
= 4 mA
[7]
V
DD
0.4 - - V
V
OL
LOW-level output voltage I
OL
= 4 mA
[7]
--0.4V
I
OH
HIGH-level output current V
OH
=V
DD
0.4 V
[7]
4- - mA
I
OL
LOW-level output current V
OL
= 0.4 V
[7]
4--mA
I
OHS
HIGH-level short-circuit
output current
V
OH
=0 V
[8]
--45 mA
I
OLS
LOW-level short-circuit
output current
V
OL
=V
DDA
[8]
--50mA
I
pd
pull-down current V
I
=5V
[9]
10 50 150 A
I
pu
pull-up current V
I
=0 V
[10]
15 50 85 A
V
DD
< V
I
< 5 V
[9]
000A
I
DD(act)
active mode supply
current
V
DD
= 3.3 V; T
amb
=25C;
code
while(1){}
executed from flash, no active
peripherals
CCLK = 10 MHz - 10 - mA
CCLK = 60 MHz - 40 - mA
I
DD(pd)
Power-down mode supply
current
V
DD
= 3.3 V; T
amb
=25C-60-A
V
DD
= 3.3 V; T
amb
=85C - 200 500 A
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P39P40-P42P43-P45

LPC2132FBD64,151

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Manufacturer:
NXP Semiconductors
Description:
IC MCU 32BIT 64KB FLASH 64LQFP
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