MP86961 –20A, 27V INTELLI-PHASE
SOLUTION INTEGRATED HS/LS FETS AND DRIVER IN A 5X5mm QFN
MP86961 Rev. 1.22 www.MonolithicPower.com 2
12/26/2013 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.
© 2013 MPS. All Rights Reserved.
ORDERING INFORMATION
Part Number* Package Top Marking Free Air Temperature(T
A
)
MP86961DU 5x5 QFN 86961DU
-40°C to +85°C
* For Tape & Reel, add suffix –Z (e.g. MP86961DU–Z);
For RoHS compliant packaging, add suffix –LF (e.g. MP86961DU–LF–Z)
PACKAGE REFERENCE
EXPOSED PAD
CONNECT TO PIN
PIN 1 ID
GND
GND
GND
GND
GND
GND
GND
GND
GND
N/C
VCC
EN
SYNC
PWM
PG
BST
IN
AGND
18
17
16
15
14
13
12
11
10
1
2
3
4
5
6
7
8
9
GND
GND
GND
GND
SW
IN
IN
IN
IN
SW
SW
SW
ABSOLUTE MAXIMUM RATINGS
(1)
Supply Voltage V
IN
....................................... 27V
V
SW………………………………………..
-0.3V (-3V for
<20ns) …………………….to V
IN
+ 0.3V (+3V
for <20ns)
V
BST
...................................................... V
SW
+ 6V
All Other Pins..................................-0.3V to +6V
Continuous Power Dissipation (T
A
= +25°C)
(2)
............................................................. 3.5W
Junction Temperature...............................150°C
Lead Temperature ....................................260°C
Storage Temperature............... -65°C to +150°C
Recommended Operating Conditions
(3)
Supply Voltage V
IN
...........................4.5V to 21V
V
CC
Driver Voltage …………………4.5V to 5.5V
Operating Junct. Temp (T
J
)...... -40°C to +125°C
Thermal Resistance
(4)
θ
JA
θ
JC
5x5 QFN ................................. 36 ....... 8.... °C/W
Notes:
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of the
maximum junction temperature T
J
(MAX), the junction-to-
ambient thermal resistance θ
JA
, and the ambient temperature
T
A
. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by P
D
(MAX)=(T
J
(MAX)-
T
A
)/ θ
JA
. Exceeding the maximum allowable power dissipation
will cause excessive die temperature.
3) The device is not guaranteed to function outside of its
operating conditions.
4) Measured on approximately 4” square of 4-layer PCB.
