Characteristics STPS30L30C
4/9 Doc ID 5506 Rev 6
Figure 12. Reverse safe operating area (t
p
< 1 µs and T
j
< 150 °C)
Figure 8. Reverse leakage current versus
reverse voltage applied (typical
values per diode)
Figure 9. Junction capacitance versus
reverse voltage applied
(typical values per diode)
0 5 10 15 20 25 30
1E-2
1E-1
1E+0
1E+1
1E+2
1E+3
VR(V)
IR(mA)
Tj=125°C
Tj=25°C
Tj=150°C
12 51020 50
0.1
1.0
5.0
VR(V)
C(nF)
F=1MHz
Tj=25°C
Figure 10. Forward voltage drop versus
forward current (maximum values
per diode)
Figure 11. Thermal resistance junction to
ambient versus copper surface
under tab
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
1
10
100
200
VFM(V)
IFM(A)
Tj=15 0 °C
(typical values)
Tj=12 5 °C
Tj=25 °C
0 4 8 12 16 20 24 28 32 36 40
0
10
20
30
40
50
60
70
80
S(Cu) (cm²)
Rth(j-a) (°C/W)
Epoxy printed circuit board, D
2
PA K
copper thickness = 35 µm
20
25
30
35
40
45
50
55
30 35 40 45 50 55 60
Forbidden area
Operating area
Varm (V)
Iarm (A)
