13
INDUSTRIAL TEMPERATURE RANGE
IDT72V73260 3.3V TIME SLOT INTERCHANGE
DIGITAL SWITCH 16,384 x 16,384
TCK
Device Inputs
(1)
TDI/TMS
t
JDC
tJS
tJRSR
tJF
tJR
x
tJCL
tJCYC
tJCH
tJH
tJCD
tJRST
Device Outputs
(2)
TDO
TRST
5932 drw06
TABLE 12 — SYSTEM INTERFACE PARAMETERS
NOTES:
1. Device outputs = All device outputs except TDO.
2. Device inputs = All device inputs except TDI, TMS and TRST.
INSTRUCTION CODE DESCRIPTION
EXTEST 0000 Forces contents of the boundary scan cells onto the device outputs
(1)
. Places the boundary scan register (BSR) between TDI and TDO.
BYPASS 1111 Places the bypass register (BYR) between TDI and TDO.
IDCODE 0010 Loads the ID register (IDR) with the vendor ID code and places the register between TDI and TDO.
HIGH-Z 0100 Places the bypass register (BYR) between TDI and TDO. Forces all device output drivers to a High-Z state.
CLAMP 0011 Places the bypass register (BYR) between TDI and TDO. Forces contents of the boundary scan cells onto the device outputs.
SAMPLE/PRELOAD 0001 Places the boundary scan register (BSR) between TDI and TDO. SAMPLE allows data from device inputs
(2)
and outputs
(1)
to be
captured in the boundary scan cells and shifted serially through TDO. PRELOAD allows data to be input serially into the boundary
scan cells via the TDI.
RESERVED All other codes Several combinations are reserved. Do not use other codes than those identified above.
SYMBOL PARAMETER MIN. MAX. UNITS
tJCYC JTAG Clock Input Period 100 ns
tJCH JTAG Clock HIGH 40 ns
tJCL JTAG Clock LOW 40 ns
tJR JTAG Clock Rise Time 3
(1)
ns
tJF JTAG Clock Fall Time 3
(1)
ns
tJRST JTAG Reset 50 ns
tJRSR JTAG Reset Recovery 50 ns
tJCD JTAG Data Output 25 ns
tJDC JTAG Data Output Hold 0 ns
tJS JTAG Setup 15 ns
t
JH JTAG Hold 15 ns
TABLE 13 — JTAG AC ELECTRICAL CHARACTERISTICS
(1,2,3,4)
NOTES:
1. Guaranteed by design.
2. 30pF loading on external output signals.
3. Refer to AC Electrical Test Conditions stated earlier in this document.
4. JTAG operations occur at one speed (10MHz). The base device may run at any speed specified in this datasheet.
Figure 3. JTAG Timing Specifications
NOTES:
1. Device inputs = All device inputs except TDI, TMS and TRST.
2. Device outputs = All device outputs except TDO.
14
INDUSTRIAL TEMPERATURE RANGE
IDT72V73260 3.3V TIME SLOT INTERCHANGE
DIGITAL SWITCH 16,384 x 16,384
TABLE 14 — BOUNDARY SCAN REGISTER BITS
Boundary Scan Bit 0 to bit 168
Device Pin Input Output Three-State
Scan Cell Scan Cell Control
TX27/OEI11 89 90
TX26/OEI10 91 92
TX25/OEI9 93 94
TX24/OEI8 95 96
TX23/OEI7 97 98
TX22/OEI6 99 100
TX21OEI5 101 102
TX20/OEI4 103 104
TX19/OEI3 105 106
TX18/OEI2 107 108
TX17/OEI1 109 110
TX16/OEI0 111 112
RX23 113
RX22 114
RX21 115
RX20 116
RX19 117
RX18 118
RX17 119
RX16 120
RX15 121
RX14 122
RX13 123
RX12 124
RX11 125
RX10 126
RX9 127
RX8 128
TX15 129 130
TX14 131 132
TX13 133 134
TX12 135 136
TX11 137 138
TX10 139 140
TX9 141 142
TX8 143 144
TX7 145 146
TX6 147 148
TX5 149 150
TX4 151 152
TX3 153 154
TX2 155 156
TX1 157 158
TX0 159 160
RX7 161
RX6 162
RX5 163
RX4 164
RX3 165
RX2 166
RX1 167
RX0 168
Boundary Scan Bit 0 to bit 168
Device Pin Input Output Three-State
Scan Cell Scan Cell Control
ODE 0
RESET 1
C32i 2
F32i 3
FE 4
DS 5
CS 6
R/W 7
A0 8
A1 9
A2 10
A3 11
A4 12
A5 13
A6 14
A7 15
A8 16
A9 17
A10 18
A11 19
A12 20
A13 21
A14 22
A15 23
DTA 24
D15 25 26 27
D14 28 29 30
D13 31 32 33
D12 34 35 36
D11 37 38 39
D10 40 41 42
D9 43 44 45
D8 46 47 48
D7 49 50 51
D6 52 53 54
D5 55 56 57
D4 58 59 60
D3 61 62 63
D2 64 65 66
D1 67 68 69
D0 70 71 72
RX31 73
RX30 74
RX29 75
RX28 76
RX27 77
RX26 78
RX25 79
RX24 80
TX31/OEI15 81 82
TX30/OEI14 83 84
TX29/OEI13 85 86
TX28/OEI12 87 88
15
INDUSTRIAL TEMPERATURE RANGE
IDT72V73260 3.3V TIME SLOT INTERCHANGE
DIGITAL SWITCH 16,384 x 16,384
Figure 4. Creating Larger Switch Matrices
APPLICATIONS
CREATING LARGE SWITCH MATRICES
To create a switch matrix with twice the capacity of a given TSI device, four
devices must be used. In the example below, four IDT72V73260, 16K x 16K
channel capacity devices are used to create an 32K x 32K channel switch matrix.
As can be seen, Device #1 and Device #2 will receive the same incoming
RX0-31 data and thus have the same contents in Data Memory. On the output
side, however Device #1 is used to switch data out on to TX0-31 where as
Device #2 is used to switch out on TX 32-63. Likewise Device #3 and Device #4
are used in the same way as Device #1 and Device #2 but switch RX 32-63
to TX0-31 and TX32-63, respectively. With this configuration all possible
combinations of input and output streams are possible. In short, Device #1 is
used to switch RX0-31 to TX0-31, Device #2 to switch RX0-31 to TX32-63,
Device #3 to switch RX 32-63 to TX0-31, and Device #4 to switch RX32-63
to TX32-63.
Device 1
IDT72V73260
Device 3
IDT72V73260
Device 4
IDT72V73260
RX0-31
RX32-63
TX0-31
TX32-63
5932 drw07
Device 2
IDT72V73260

72V73260BBG8

Mfr. #:
Manufacturer:
IDT
Description:
Digital Bus Switch ICs 16K x 16K TSI 32 I/O 32Mbps, 3.3V
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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