IRFR9120NTRLPBF

IRFR9120NPbF
IRFU9120NPbF
HEXFET
®
Power MOSFET
V
DSS
= -100V
R
DS(on)
= 0.48
I
D
= -6.6A
12/14/04
Parameter Typ. Max. Units
R
θJC
Junction-to-Case  3.1
R
θJA
Junction-to-Ambient (PCB mount)**  50 °C/W
R
θJA
Junction-to-Ambient  110
Thermal Resistance
D-Pak
T
O-252AA
I-Pak
TO-251AA
l Ultra Low On-Resistance
l P-Channel
l Surface Mount (IRFR9120N)
l Straight Lead (IRFU9120N)
l Advanced Process Technology
l Fast Switching
l Fully Avalanche Rated
Description
Parameter Max. Units
I
D
@ T
C
= 25°C Continuous Drain Current, V
GS
@ -10V -6.6
I
D
@ T
C
= 100°C Continuous Drain Current, V
GS
@ -10V -4.2 A
I
DM
Pulsed Drain Current -26
P
D
@T
C
= 25°C Power Dissipation 40 W
Linear Derating Factor 0.32 W/°C
V
GS
Gate-to-Source Voltage ± 20 V
E
AS
Single Pulse Avalanche Energy 100 mJ
I
AR
Avalanche Current -6.6 A
E
AR
Repetitive Avalanche Energy 4.0 mJ
dv/dt Peak Diode Recovery dv/dt -5.0 V/ns
T
J
Operating Junction and -55 to + 150
T
STG
Storage Temperature Range
Soldering Temperature, for 10 seconds 300 (1.6mm from case )
°C
Absolute Maximum Ratings
Fifth Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This benefit,
combined with the fast switching speed and ruggedized
device design that HEXFET Power MOSFETs are well
known for, provides the designer with an extremely efficient
and reliable device for use in a wide variety of applications.
The D-Pak is designed for surface mounting using vapor
phase, infrared, or wave soldering techniques. The straight
lead version (IRFU series) is for through-hole mounting
applications. Power dissipation levels up to 1.5 watts are
possible in typical surface mount applications.
S
D
G
PD-95020A
l Lead-Free
www.irf.com 1
IRFR/U9120NPbF
Source-Drain Ratings and Characteristics
Parameter Min. Typ. Max. Units Conditions
I
S
Continuous Source Current MOSFET symbol
(Body Diode)
 
showing the
I
SM
Pulsed Source Current integral reverse
(Body Diode)
 
p-n junction diode.
V
SD
Diode Forward Voltage   -1.6 V T
J
= 25°C, I
S
= -3.9A, V
GS
= 0V
t
rr
Reverse Recovery Time  100 150 ns T
J
= 25°C, I
F
= -4.0A
Q
rr
Reverse Recovery Charge  420 630 nC di/dt = 100A/µs

t
on
Forward Turn-On Time Intrinsic turn-on time is negligible (turn-on is dominated by L
S
+L
D
)
-6.6
-26
A
Notes:
** When mounted on 1" square PCB (FR-4 or G-10 Material ) .
For recommended footprint and soldering techniques refer to application note #AN-994
This is applied for I-PAK, L
S
of D-PAK is measured between
lead and center of die contact
Starting T
J
= 25°C, L = 13mH
R
G
= 25, I
AS
= -3.9A. (See Figure 12)
Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
I
SD
-4.0A, di/dt 300A/µs, V
DD
V
(BR)DSS
,
T
J
150°C
Pulse width 300µs; duty cycle 2%.
S
D
G
Parameter Min. Typ. Max. Units Conditions
V
(BR)DSS
Drain-to-Source Breakdown Voltage -100   V V
GS
= 0V, I
D
= -250µA
V
(BR)DSS
/T
J
Breakdown Voltage Temp. Coefficient  -0.11  V/°C Reference to 25°C, I
D
= -1mA
R
DS(on)
Static Drain-to-Source On-Resistance   0.48 V
GS
= -10V, I
D
= -3.9A
V
GS(th)
Gate Threshold Voltage -2.0  -4.0 V V
DS
= V
GS
, I
D
= -250µA
g
fs
Forward Transconductance 1.4   S V
DS
= -50V, I
D
= -4.0A
  -25
µA
V
DS
= -100V, V
GS
= 0V
  -250 V
DS
= -80V, V
GS
= 0V, T
J
= 150°C
Gate-to-Source Forward Leakage   100 V
GS
= 20V
Gate-to-Source Reverse Leakage   -100
nA
V
GS
= -20V
Q
g
Total Gate Charge   27 I
D
= -4.0A
Q
gs
Gate-to-Source Charge   5.0 nC V
DS
= -80V
Q
gd
Gate-to-Drain ("Miller") Charge   15 V
GS
= -10V, See Fig. 6 and 13 
t
d(on)
Turn-On Delay Time  14  V
DD
= -50V
t
r
Rise Time  47 I
D
= -4.0A
t
d(off)
Turn-Off Delay Time  28  R
G
= 12
t
f
Fall Time  31  R
D
=12 Ω, See Fig. 10 
Between lead,
 
6mm (0.25in.)
from package
and center of die contact
C
iss
Input Capacitance  350  V
GS
= 0V
C
oss
Output Capacitance  110  pF V
DS
= -25V
C
rss
Reverse Transfer Capacitance  70   = 1.0MHz, See Fig. 5
nH
Electrical Characteristics @ T
J
= 25°C (unless otherwise specified)
L
D
Internal Drain Inductance
L
S
Internal Source Inductance  
I
GSS
ns
4.5
7.5
I
DSS
Drain-to-Source Leakage Current
S
D
G
Uses IRF9520N data and test conditions.
IRFR/U9120NPbF
Fig 4. Normalized On-Resistance
Vs. Temperature
Fig 2. Typical Output Characteristics
Fig 1. Typical Output Characteristics
Fig 3. Typical Transfer Characteristics
0.1
1
10
100
0.1 1 10 100
20µs PULSE WIDTH
T = 25 C
J
°
TOP
BOTTOM
VGS
-15V
-10V
-8.0V
-7.0V
-6.0V
-5.5V
-5.0V
-4.5V
-V , Drain-to-Source Voltage (V)
-I , Drain-to-Source Current (A)
DS
D
-4.5V
0.1
1
10
100
0.1 1 10 100
20µs PULSE WIDTH
T = 150 C
J
°
TOP
BOTTOM
VGS
-15V
-10V
-8.0V
-7.0V
-6.0V
-5.5V
-5.0V
-4.5V
-V , Drain-to-Source Voltage (V)
-I , Drain-to-Source Current (A)
DS
D
-4.5V
0.1
1
10
100
4 5 6 7 8 9 10
V = -50V
20µs PULSE WIDTH
DS
-V , Gate-to-Source Voltage (V)
-I , Drain-to-Source Current (A)
GS
D
T = 25 C
J
°
T = 150 C
J
°
-60 -40 -20 0 20 40 60 80 100 120 140 160
0.0
0.5
1.0
1.5
2.0
2.5
T , Junction Temperature ( C)
R , Drain-to-Source On Resistance
(Normalized)
J
DS(on)
°
V =
I =
GS
D
-10V
-6.7A

IRFR9120NTRLPBF

Mfr. #:
Manufacturer:
Infineon Technologies
Description:
MOSFET MOSFT PCh -6.5A 480mOhm 18nC
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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