BAS216,115

DATA SHEET
Product data sheet
Supersedes data of 1999 Apr 22
2002 May 28
DISCRETE SEMICONDUCTORS
BAS216
High-speed switching diode
db
ook, halfpage
M3D154
2002 May 28 2
NXP Semiconductors Product data sheet
High-speed switching diode BAS216
FEATURES
Small ceramic SMD package
High switching speed: max. 4 ns
Continuous reverse voltage:
max.
75 V
Repetitive peak reverse voltage:
max.
85 V
Repetitive peak forward current:
max.
500 mA.
APPLICATIONS
High-speed switching in e.g.
surface mounted circuits.
DESCRIPTION
The BAS216 is a high-speed switching diode fabricated in planar technology,
and encapsulated in the SOD110 very small rectangular ceramic SMD
package.
handbook, 4 columns
MAM139
ka
cathode mark
top viewside viewbottom view
ak
Fig.1 Simplified outline (SOD110) and symbol.
Marking code: A6.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
Note
1. Device mounted on an FR4 printed-circuit board.
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
RRM
repetitive peak reverse voltage 85 V
V
R
continuous reverse voltage 75 V
I
F
continuous forward current note 1 250 mA
I
FRM
repetitive peak forward current 500 mA
I
FSM
non-repetitive peak forward current square wave; T
j
= 25 °C prior to
surge; see
Fig.4
t = 1 µs 4 A
t = 1 ms 1 A
t = 1 s 0.5 A
P
tot
total power dissipation T
amb
= 25 °C; see Fig.2; note 1 400 mW
T
stg
storage temperature 65 +150 °C
T
j
junction temperature 150 °C
2002 May 28 3
NXP Semiconductors Product data sheet
High-speed switching diode BAS216
ELECTRICAL CHARACTERISTICS
T
j
= 25 °C unless otherwise specified.
THERMAL CHARACTERISTICS
Note
1. Device mounted on an FR4 printed-circuit board.
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
F
forward voltage see Fig.3
I
F
= 1 mA 715 mV
I
F
= 10 mA 855 mV
I
F
= 50 mA 1 V
I
F
= 150 mA 1.25 V
I
R
reverse current see Fig.5
V
R
= 25 V 30 nA
V
R
= 75 V 1 µA
V
R
= 25 V; T
j
= 150 °C 30 µA
V
R
= 75 V; T
j
= 150 °C 50 µA
C
d
diode capacitance f = 1 MHz; V
R
= 0; see Fig.6 1.5 pF
t
rr
reverse recovery time when switched from I
F
= 10 mA to
I
R
= 10 mA; R
L
= 100 ; measured
at I
R
= 1 mA; see Fig.7
4 ns
V
fr
forward recovery voltage when switched from I
F
= 10 mA;
t
r
= 20 ns; see Fig.8
1.75 V
SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th j-tp
thermal resistance from junction to tie-point 200 K/W
R
th j-a
thermal resistance from junction to ambient note 1 315 K/W

BAS216,115

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
DIODE GEN PURP 75V 250MA SOD2
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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