LTC4558EUD#PBF

LTC4558
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10kV ESD Protection
All Smart Card pins (CLKA,B, RSTA,B, I/OA,B, V
CCA,B
and
GND) can withstand over 10kV of human body model ESD
in-situ. In order to ensure proper ESD protection, careful
board layout is required. The GND pin should be tied di-
rectly to a ground plane. The V
CCA,B
capacitors should be
located very close to the V
CCA,B
pins and tied immediately
to the ground plane.
Capacitor Selection
A total of four capacitors is required to operate the LTC4558.
An input bypass capacitor is required at V
BATT
and DV
CC
.
Output bypass capacitors are required on each of the
Smart Card V
CC
pins.
There are several types of ceramic capacitors available,
each having considerably different characteristics. For
example, X7R ceramic capacitors have excellent voltage
and temperature stability but relatively low packing density.
Y5V and X5R ceramic capacitors have apparently higher
APPLICATIONS INFORMATION
Figure 2. Additional Components for Improved Compliance Testing
packing density but poor performance over their rated
voltage or temperature ranges. Under certain voltage
and temperature conditions Y5V, X5R and X7R ceramic
capacitors can be compared directly by case size rather
than specifi ed value for a desired minimum capacitance.
The V
CCA,B
outputs should be bypassed to GND with a 1μF
capacitor. A low ESR ceramic capacitor is recommended
on each V
CC
pin to ensure ESD compliance.
V
BATT
and DV
CC
should be bypassed with 0.1μF ceramic
capacitors.
Compliance Testing
Inductance due to long leads on type approval equipment
can cause ringing and overshoot that leads to testing prob-
lems. Small amounts of capacitance and damping resistors
can be included in the application without compromising
the normal electrical performance of the LTC4558 or Smart
Card system. Generally a 100Ω resistor and a 20pF capaci-
tor will accomplish this, as shown in Figure 2.
100Ω
100Ω
100Ω
20pF
20pF
20pF
20pF
1μF
4558 F02
V
CCA,B
CLKA,B
LTC4558
RSTA,B
I/OA,B
SMART
CARD
SOCKET
LTC4558
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Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
3.00 ± 0.10
(4 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
1.65 ± 0.05
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
0.40 ± 0.10
BOTTOM VIEW—EXPOSED PAD
1.65 ± 0.10
(4-SIDES)
0.75 ± 0.05
R = 0.115
TYP
R = 0.05
TYP
0.20 ± 0.05
1
PIN 1 NOTCH
R = 0.20 TYP
OR 0.25 × 45°
CHAMFER
19 20
2
0.40 BSC
0.200 REF
2.10 ± 0.05
3.50 ± 0.05
(4 SIDES)
0.70 ±0.05
0.00 – 0.05
(UD20) QFN 0306 REV A
0.20 ±0.05
0.40 BSC
PACKAGE
OUTLINE
UD Package
20-Lead Plastic QFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1720 Rev A)
LTC4558
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4558fa
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900
FAX: (408) 434-0507
www.linear.com
© LINEAR TECHNOLOGY CORPORATION 2007
LT 0407 REV A • PRINTED IN USA
PART NUMBER DESCRIPTION COMMENTS
LTC1555L/
LTC1555L-1.8
1MHz, SIM Power Supply and Level
Translator for 1.8V/3V/5V SIM Cards
V
IN
: 2.6V to 6.6V, V
OUT
= 1.8V/3V/5V, I
Q
= 32μA, I
SD
< 1μA, SSOP16
LTC1555/LTC1556 650kHz, SIM Power Supply and Level
Translator for 3V/5V SIM Cards
V
IN
: 2.7V to 10V, V
OUT
= 3V/5V, I
Q
= 60μA, I
SD
< 1μA, SSOP16, SSOP20
LTC1755/LTC1756 850kHz, Smart Card Interface with
Serial Control for 3V/5V Smart Card
Applications
V
IN
: 2.7V to 7V, V
OUT
= 3V/5V, I
Q
= 60μA, I
SD
< 1μA, SSOP16, SSOP24
LTC1955 Dual Smart Card Interface with Serial
Control for 1.8V/3V/5V Smart Card
Applications
V
IN
: 3V to 5.5V, V
OUT
= 1.8V/3V/5V, I
Q
= 200μA, I
SD
< 1μA, QFN32
LTC1986 900kHz, SIM Power Supply for 3V/5V
SIM Cards
V
IN
: 2.6V to 4.4V, V
OUT
= 3V/5V, I
Q
= 14μA, I
SD
< 1μA, ThinSOT
LTC4555 SIM Power Supply and Level Translator
for 1.8V/3V SIM Cards
V
IN
: 3V to 6V, V
OUT
= 1.8V/3V, I
Q
= 40μA, I
SD
< 1μA, QFN16
LTC4556 Smart Card Interface with Serial
Control
V
IN
: 2.7V to 5.5V, V
OUT
= 1.8V/3V/5V, I
Q
= 250μA, I
SD
< 1μA, 4 × 4 QFN24
LTC4557 Dual SIM/Smart Card Power Supply
and Level Translator for 1.8V/3V Cards
V
IN
: 2.7V to 5.5V, V
OUT
= 1.8V/3V, I
Q
= 250μA, I
SD
< 1μA, QFN16
ThinSOT is a trademark of Linear Technology Corporation.
RELATED PARTS
TYPICAL APPLICATION
DV
CC
V
BATT
V
BATT
3V TO 6V
DV
CC
1.4V TO 4.4V
LTC4558
μCONTROLLER
V
CCA
I/OA
DV
CC
RSTA
CLKA
C1
C1
C5
C5
C3
C2
C7
C7
C2
C3
GND
V
CCB
CLKB
RSTB
I/OB
CLKIN
C4
0.1μF
C1
1μF
C2
1μF
RSTIN
DATA
CSEL
VSELA
VSELB
ENABLEA
ENABLEB
CLKRUNA
CLKRUNB
C3
0.1μF
4558 TA01a
1.8V/3V
SIM
CARD A
1.8V/3V
SIM
CARD B
V
CC
I/O
RST
CLK
GND
GND
V
CC
CLK
RST
I/O

LTC4558EUD#PBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
Power Management Specialized - PMIC 2x SIM/Smart Card Pwr S & Int
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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