© Semiconductor Components Industries, LLC, 2014
September, 2014 − Rev. 8
1 Publication Order Number:
NTD4808N/D
NTD4808N, NVD4808N
Power MOSFET
30 V, 63 A, Single N−Channel, DPAK/IPAK
Features
• Low R
DS(on)
to Minimize Conduction Losses
• Low Capacitance to Minimize Driver Losses
• Optimized Gate Charge to Minimize Switching Losses
• NVD Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
• These are Pb−Free Devices
Applications
• CPU Power Delivery
• DC−DC Converters
• Low Side Switching
MAXIMUM RATINGS (T
J
= 25°C unless otherwise stated)
Parameter
Symbol Value Unit
Drain−to−Source Voltage V
DSS
30 V
Gate−to−Source Voltage V
GS
±20 V
Continuous Drain
Current R
q
JA
(Note 1)
Steady
State
T
A
= 25°C
I
D
13.8
A
T
A
= 85°C 10.7
Power Dissipation
R
q
JA
(Note 1)
T
A
= 25°C P
D
2.63 W
Continuous Drain
Current R
q
JA
(Note 2)
T
A
= 25°C
ID
10
A
T
A
= 85°C 7.8
Power Dissipation
R
q
JA
(Note 2)
T
A
= 25°C P
D
1.4 W
Continuous Drain
Current R
q
JC
(Note 1)
T
C
= 25°C
I
D
63
A
T
C
= 85°C 49
Power Dissipation
R
q
JC
(Note 1)
T
C
= 25°C P
D
54.6 W
Pulsed Drain
Current
t
p
=10ms
T
A
= 25°C I
DM
126 A
Current Limited by Package T
A
= 25°C I
DmaxPkg
45 A
Operating Junction and Storage
Temperature
T
J
,
T
STG
−55 to
+175
°C
Source Current (Body Diode) I
S
45 A
Drain to Source dV/dt dV/dt 6 V/ns
Single Pulse Drain−to−Source Avalanche
Energy (V
DD
= 24 V, V
GS
= 10 V,
I
L
= 17 A
pk
, L = 1.0 mH, R
G
= 25 W)
EAS 144.5 mJ
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
T
L
260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
MARKING DIAGRAMS
& PIN ASSIGNMENTS
http://onsemi.com
V
(BR)DSS
R
DS(ON)
MAX I
D
MAX
30 V
8.0 mW @ 10 V
63 A
12.4 mW @ 4.5 V
G
S
N−Channel
D
DPAK
CASE 369AA
STYLE 2
IPAK
CASE 369D
STYLE 2
See detailed ordering and shipping information on page 6 o
this data sheet.
ORDERING INFORMATION
1
Gate
2
Drain
3
Source
4
Drain
4
Drain
2
Drain
1
Gate
3
Source
AYWW
48
08NG
A = Assembly Location*
Y = Year
WW = Work Week
4808N = Device Code
G = Pb−Free Package
1
2
3
4
AYWW
48
08NG
1
2
3
4
* The Assembly Location code (A) is front side
optional. In cases where the Assembly Location is
stamped in the package, the front side assembly
code may be blank.