LTM2882
16
2882fd
Typical applicaTions
Figure 9. Single Line Dual Half-Duplex
Isolated Transceiver
2882 F09
ON
DIN
T1IN
R1OUT
T2IN
R2OUT
DE
DOUT
T1OUT
R1IN
T2OUT
R2IN
LTM2882
3.3V (LTM2882-3)
5V (LTM2882-5)
V
L
V
CC
GND GND2
3.3k
ISOLATION BARRIER
T
X
R
X
3.3k
Figure 13. Isolated Multirail Power Supply
with Switched Outputs
Figure 10. Driving Larger Capacitive Loads
Figure 11. 1.8V Microprocessor Interface
2882 F10
ON
DIN
T1IN
R1OUT
T2IN
R2OUT
DE
DOUT
T1OUT
R1IN
T2OUT
R2IN
LTM2882
3.3V (LTM2882-3)
5V (LTM2882-5)
V
L
V
CC
GND GND2
ISOLATION BARRIER
3k C
L
DATA RATE
(kbps)
100 5
250 2
1000 0.5
C
L
(nF)
2882 F11
ON
DIN
T1IN
R1OUT
T2IN
R2OUT
DE
DOUT
T1OUT
R1IN
T2OUT
R2IN
LTM2882
µP
V
L
V
CC
GND
1.8V
3.3V (LTM2882-3)
5V (LTM2882-5)
ISOLATION BARRIER
GND2
Figure 12. Isolated 5V Power Supply
2882 F12
ON
DIN
T1IN
R1OUT
T2IN
R2OUT
DE
DOUT
T1OUT
R1IN
T2OUT
R2IN
LTM2882
V
L
V
CC
V
CC2
GND
3.3V (LTM2882-3)
5V (LTM2882-5)
5V
REGULATED
150mA (LTM2882-5)
100mA (LTM2882-3)
ISOLATION BARRIER
GND2
ONOFF
2882 F13
ON
DIN
T1IN
R1OUT
T2IN
R2OUT
DE
DOUT
T1OUT
R1IN
T2OUT
R2IN
LTM2882
3.3V (LTM2882-3)
5V (LTM2882-5)
5V
REGULATED
7V
SWITCHED
RETURN
6.3V
SWITCHED
V
L
V
CC
V
CC2
GND GND2
ISOLATION BARRIER
ONOFF
LTM2882
17
2882fd
package DescripTion
BGA Package
32-Lead (15mm × 11.25mm × 3.42mm)
(Reference LTC DWG # 05-08-1851 Rev B)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
2. ALL DIMENSIONS ARE IN MILLIMETERS
BALL DESIGNATION PER JESD MS-028 AND JEP95
5. PRIMARY DATUM -Z- IS SEATING PLANE
4
3
DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
PACKAGE TOP VIEW
4
PIN “A1”
CORNER
X
Y
aaa Z
aaa Z
PACKAGE BOTTOM VIEW
3
SEE NOTES
SUGGESTED PCB LAYOUT
TOP VIEW
BGA 32 0110 REV B
LTMXXXXXX
µModule
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
COMPONENT
PIN “A1”
DETAIL A
PIN 1
0.000
0.635
0.635
1.905
1.905
3.175
3.175
4.445
4.445
6.350
6.350
5.080
5.080
0.000
DETAIL A
Øb (32 PLACES)
F
G
H
L
J
K
E
A
B
C
D
2 14 35678
DETAIL B
SUBSTRATE
0.27 – 0.37
2.45 – 2.55
// bbb Z
D
A
A1
b1
ccc Z
DETAIL B
PACKAGE SIDE VIEW
MOLD
CAP
Z
M
X YZddd
M
Zeee
0.630 ±0.025 Ø 32x
SYMBOL
A
A1
A2
b
b1
D
E
e
F
G
aaa
bbb
ccc
ddd
eee
MIN
3.22
0.50
2.72
0.73
0.60
NOM
3.42
0.60
2.82
0.78
0.63
15.0
11.25
1.27
12.70
8.89
MAX
3.62
0.70
2.92
0.83
0.66
0.15
0.10
0.20
0.30
0.15
NOTES
DIMENSIONS
TOTAL NUMBER OF BALLS: 32
E
b
e
e
b
A2
F
G
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
LTM2882
18
2882fd
package DescripTion
LGA Package
32-Lead (15mm × 11.25mm × 2.82mm)
(Reference LTC DWG # 05-08-1773 Rev Ø)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
2. ALL DIMENSIONS ARE IN MILLIMETERS
LAND DESIGNATION PER JESD MO-222
5. PRIMARY DATUM -Z- IS SEATING PLANE
6. THE TOTAL NUMBER OF PADS: 32
4
3
DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
DETAIL B
DETAIL B
SUBSTRATE
MOLD
CAP
0.290 – 0.350
2.400 – 2.600
bbb Z
Z
PACKAGE TOP VIEW
11.25
BSC
15.00
BSC
4
PAD “A1”
CORNER
X
Y
aaa Z
aaa Z
PACKAGE BOTTOM VIEW
3
PADS
SEE NOTES
SUGGESTED PCB LAYOUT
TOP VIEW
LGA 32 0308 REV Ø
LTMXXXXXX
µModule
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
COMPONENT
PIN “A1”
8.89
BSC
1.27
BSC
PAD 1
0.635
0.635
1.905
1.905
3.175
3.175
4.445
4.445
6.350
6.350
5.080
5.080
0.000
SYMBOL
aaa
bbb
eee
TOLERANCE
0.10
0.10
0.05
DETAIL A
0.630 ±0.025 Ø 32x
S
YXeee
DETAIL C
0.630 ±0.025 Ø 32x
S
YXeee
F
G
H
L
J
K
E
A
B
C
D
2 14 3567
2.69 – 2.95
DETAIL A
12.70
BSC
8
DETAIL c
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.

LTM2882IV-3#PBF

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
RS-232 Interface IC Complete Isolated RS232 uModule Transceiver + Power
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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