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SF2039B (R) 3/27/14 Page 6 of 7
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SMP-03 Case
Recommended PCB Footprint
Case Dimensions
Dimension
mm Inches
Min Nom Max Min Nom Max
A 6.80 7.00 7.20 0.268 0.276 0.283
B 4.80 5.00 5.20 0.189 0.197 0.205
C 1.65 2.00 0.065 0.079
D .47 0.60 .73 0.019 0.024 0.029
E 2.41 2.54 2.67 0.095 0.100 0.105
H 0.87 1.0 1.13 0.034 0.039 0.044
J 4.87 5.00 5.13 0.192 0.197 0.202
K 2.87 3.00 3.13 0.113 0.118 0.123
P 1.14 1.27 1.40 0.045 0.050 0.055
Materials
Solder Pad
Termination
Au plating 30 - 60 uInches (76.2-152 uM) over 80-
200 uInches (203-508 uM) Ni.
Lid
Fe-Ni-Co Alloy Electroless Nickel Plate (8-11% Phos-
phorus) 100-200 uInches Thick
Body Al
2
O
3
Ceramic
Pb Free
Electrical Connections
Connection Terminals
Port 1
Input or Return 10
Return or Input 1
Port 2
Output or Return 5
Return or Output 6
Ground All others
Single Ended Operation Return is ground
Differential Operation Return is hot
A
B
C
H
E
P
D
H
J
K
10-Terminal Ceramic Surface-Mount Case
7 x 5 mm Nominal Footprint
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