HMC8325 Data Sheet
Rev. 0 | Page 4 of 16
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
Drain Bias Voltage (V
to V
) 4.5 V
Gate Bias Voltage (V
to V
) −3 V to 0 V
Maximum Junction Temperature (to
Maintain 1 Million Hours Mean Time to
Failure (MTTF))
175°C
Storage Temperature Range −65°C to +150°C
Operating Temperature Range −55°C to +85°C
ESD Sensitivity, Human Body Model (HBM) Class 0 (150 V)
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
Table 3. Thermal Resistance
C-22-1
2
225 °C/W
1
Based on ABLEBOND® 84-1LMIT as die attach epoxy.
2
Test Condition: Thermal impedance simulated values are based on
JEDEC 2S2P thermal test board with four thermal vias. See JEDEC JESD51.
ESD CAUTION