AX−SFUS, AX−SFUS−API
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17
QFN40 PACKAGE INFORMATION
QFN40 7x5, 0.5P
CASE 485EG
ISSUE A
SEATING
NOTE 4
0.15 C
(A3)
A
A1
D2
b
1
21
40
2X
2X
E2
40X
9
L
40X
BOTTOM VIEW
DETAIL A
TOP VIEW
SIDE VIEW
D
A B
E
0.15
C
PIN ONE
REFERENCE
0.10 C
0.08 C
C
29
e
A0.10 B
C
0.05
C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSIONS: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30mm FROM TERMINAL
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
DIM MIN MAX
MILLIMETERS
A 0.80 1.00
A1 0.00 0.05
A3 0.20 REF
b 0.18 0.30
D 7.00 BSC
D2 5.30 5.50
E 5.00 BSC
3.50E2 3.30
e 0.50 BSC
L 0.30 0.50
L1 −−− 0.15
PLANE
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
e/2
NOTE 3
DIMENSIONS: MILLIMETERS
0.50
5.60
0.32
3.60
40X
0.60
40X
5.30
7.30
1
PITCH
PACKAGE
OUTLINE
RECOMMENDED
L1
DETAIL A
L
ALTERNATE TERMINAL
CONSTRUCTIONS
L
DETAIL B
MOLD CMPDEXPOSED Cu
ALTERNATE
CONSTRUCTION
DETAIL B
