MC100EPT25DTG

MC100EPT25
www.onsemi.com
4
Table 5. TTL OUTPUT DC CHARACTERISTICS (V
CC
= 3.3 V; V
EE
= 5.5 V to 3.0 V; GND = 0.0 V; T
A
= 40°C to 85°C)
Symbol
Characteristic Condition Min Typ Max Unit
V
OH
Output HIGH Voltage I
OH
= 3.0 mA 2.2 V
V
OL
Output LOW Voltage I
OL
= 24 mA 0.5 V
I
CCH
Power Supply Current 6 10 14 mA
I
CCL
Power Supply Current 7 12 17 mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
Table 6. AC CHARACTERISTICS (V
CC
= 3.0 V to 3.6 V; V
EE
= 5.5 V to 3.0 V; GND = 0.0 V (Note 1))
Symbol Characteristic
40°C 25°C 85°C
Unit
Min Typ Max Min Typ Max Min Typ Max
f
max
Maximum Frequency
(See Figure 2 F
max
/JITTER)
275 275 275 MHz
t
PLH
, t
PHL
Propagation Delay to Output Differential
(Cross-Point to 1.5 V)
500 950 1300 800 950 1600 800 960 1600 ps
t
SKPP
Device-to-Device Skew (Note 2) 500 500 500 ps
t
JITTER
Random Clock Jitter (RMS)
(See Figure 2 F
max
/JITTER)
0.2 < 1 0.2 < 1 0.2 < 1 ps
V
PP
Input Voltage Swing (Differential) 150 800 1200 150 800 1200 150 800 1200 mV
t
r
t
f
Output Rise/Fall Times Q, Q
(0.8 V 2.0 V)
300
900
474
1160
600
1400
300
900
459
1100
600
1400
300
900
457
1100
600
1400
ps
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
1. Measured with a 750 mV 50% duty-cycle clock source. R
L
= 500 W to GND and C
L
= 20 pF to GND. Refer to Figure 3.
2. Skews are measured between outputs under identical conditions.
0
400
800
1200
1600
2000
2400
2800
25 100 175 250 325 400 475 550 625
1
2
3
4
5
6
7
Figure 2. F
max
/Jitter
FREQUENCY (MHz)
(JITTER)
V
OH
V
OL
0.5 V
V
OUTpp
(mV)
JITTER
OUT
ps (RMS)
MC100EPT25
www.onsemi.com
5
Figure 3. TTL Output Loading Used for Device Evaluation
CHARACTERISTIC TEST
C
L
*R
L
AC TEST LOAD
GND
*C
L
includes
fixture
capacitance
APPLICATION
TTL RECEIVER
Resource Reference of Application Notes
AN1405/D ECL Clock Distribution Techniques
AN1406/D Designing with PECL (ECL at +5.0 V)
AN1503/D
ECLinPSt I/O SPiCE Modeling Kit
AN1504/D Metastability and the ECLinPS Family
AN1568/D Interfacing Between LVDS and ECL
AN1672/D The ECL Translator Guide
AND8001/D Odd Number Counters Design
AND8002/D Marking and Date Codes
AND8020/D Termination of ECL Logic Devices
AND8066/D Interfacing with ECLinPS
AND8090/D AC Characteristics of ECL Devices
MC100EPT25
www.onsemi.com
6
PACKAGE DIMENSIONS
SOIC8NB
CASE 75107
ISSUE AK
SEATING
PLANE
1
4
58
N
J
X 45
_
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 75101 THRU 75106 ARE OBSOLETE. NEW
STANDARD IS 75107.
A
B
S
D
H
C
0.10 (0.004)
DIM
A
MIN MAX MIN MAX
INCHES
4.80 5.00 0.189 0.197
MILLIMETERS
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.053 0.069
D 0.33 0.51 0.013 0.020
G 1.27 BSC 0.050 BSC
H 0.10 0.25 0.004 0.010
J 0.19 0.25 0.007 0.010
K 0.40 1.27 0.016 0.050
M 0 8 0 8
N 0.25 0.50 0.010 0.020
S 5.80 6.20 0.228 0.244
X
Y
G
M
Y
M
0.25 (0.010)
Z
Y
M
0.25 (0.010) Z
S
X
S
M
____
1.52
0.060
7.0
0.275
0.6
0.024
1.270
0.050
4.0
0.155
ǒ
mm
inches
Ǔ
SCALE 6:1
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D
.
SOLDERING FOOTPRINT*

MC100EPT25DTG

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Translation - Voltage Levels Diff LVECL/ECL to LVTTL
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union