V
CES
= 1200V
I
C
= 81A@ T
C
= 100°C
V
CE(on)
typ. = 1.47V@ 33A
Gate Collector Emitter
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only; and
functional operation of the device at these or any other condition beyond those indicated in the specifications is not implied.Exposure to absolute-
maximum-rated conditions for extended periods may affect device reliability. The thermal resistance and power dissipation ratings are measured under
board mounted and still air conditions. Ambient temperature (T
A
) is 25°C, unless otherwise specified.
*Qualification standards can be found at http://www.irf.com/
E
C
G
n-channel
AUTOMOTIVE GRADE
AUIRG4PH50S
Features
• Standard: Optimized for minimum saturation
voltage and low operating frequencies (< 1kHz)
• Generation 4 IGBT design provides tighter
parameter distribution and higher efficiency
• Industry standard TO-247AC package
• Lead-Free
• Automotive Qualified *
Benefits
• Generation 4 IGBT's offer highest efficiency available
• IGBT's optimized for specified application conditions
INSULATED GATE BIPOLAR TRANSISTOR
TO-247AC
1 www.irf.com © 2015 International Rectifier Submit Datasheet Feedback March 2, 2015
Form Quantity
AUIRG4PH50S TO-247AC Tube 25 AUIRG4PH50S
Standard Pack
Base part number Complete Part NumberPackage Type
Parameter Max. Units
V
CES
Collector-to-Emitter Voltage 1200 V
I
C
@ T
C
= 25°C Continuous Collector Current
141
I
C
@ T
C
= 100°C Continuous Collector Current 81
I
CM
Pulse Collector Current, V
GE
= 15V 99
I
LM
Clamped Inductive Load Current, V
GE
= 20V 99
V
GE
Continuous Gate-to-Emitter Voltage ±20
Transient Gate-to-Emitter Voltage ±30
P
D
@ T
C
= 25°C Maximum Power Dissipation 543
P
D
@ T
C
= 100°C Maximum Power Dissipation 217
T
J
Operating Junction and
T
STG
Storage Temperature Range °C
Soldering Temperature, for 10 sec. (1.6mm from case) 300
Mounting Torque, 6-32 or M3 Screw 10 lbf·in (1.1N·m)
Thermal Resistance
Parameter
Min. Typ. Max. Units
R
θ
JC
(IGBT)
Thermal Resistance Junction-to-Case (IGBT)
––– ––– 0.23
R
θ
CS
Thermal Resistance, Case-to-Sink (flat, greased surface) ––– 0.24 –––
R
JA
Thermal Resistance, Junction-to-Ambient
––– 40 –––
-55 to +150
V
W
°C/W
A