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Data subject to change. Copyright © 2005-2013 Avago Technologies. All rights reserved. Obsoletes 5989-4253EN
AV02-1068EN - July 24, 2013
• Wave soldering parameter must be set and maintained
according to recommended temperature and dwell
time in the solder wave. Customer is advised to
periodically check on the soldering prole to ensure
the soldering prole used is always conforming to
recommended soldering condition.
• If necessary, use xture to hold the LED component
in proper orientation with respect to the PCB during
soldering process.
• Proper handling is imperative to avoid excessive
thermal stresses to LED components when heated.
Therefore, the soldered PCB must be allowed to cool
to room temperature, 25°C, before handling.
• Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size
and component orientation to assure solderability.
• Recommended PC board plated through hole sizes for
LED component leads:
LED Component
Lead Size Diagonal
Plated Through
-Hole Diameter
Lead size (typ.) 0.45 × 0.45 mm
(0.018 × 0.018 in.)
0.636 mm
(0.025 in)
0.98 to 1.08 mm
(0.039 to 0.043 in)
Dambar shear-
o area (max.)
0.65 mm
(0.026 in)
0.919 mm
(0.036 in)
Lead size (typ.) 0.50 × 0.50 mm
(0.020 × 0.020 in.)
0.707 mm
(0.028 in)
1.05 to 1.15 mm
(0.041 to 0.045 in)
Dambar shear-
o area (max.)
0.70 mm
(0.028 in)
0.99 mm
(0.039 in)
Note: Refer to application note AN1027 for more information
on soldering LED components.
Manual Solder
Wave Soldering Dipping
Pre-heat Temperature 105°C Max. –
Pre-heat Time 30 sec Max. –
Peak Temperature 250°C Max. 260°C Max.
Dwell Time 3 sec Max. 5 sec Max.
Figure 17. Recommended wave soldering prole.
Precautions:
Lead Forming
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering into PC board.
• If lead forming is required before soldering, care must
be taken to avoid any excessive mechanical stress
induced to LED package. Otherwise, cut the leads
of LED to length after soldering process at room
temperature. The solder joint formed will absorb the
mechanical stress of the lead cutting from traveling to
the LED chip die attach and wirebond.
• It is recommended that tooling made to precisely form
and cut the leads to length rather than rely upon hand
operation.
Soldering Conditions
• Care must be taken during PCB assembly and soldering
process to prevent damage to LED component.
• The closest LED is allowed to solder on board is 1.59
mm below the body (encapsulant epoxy) for those
parts without stando.
• Recommended soldering conditions:
LAMINAR WAVE
BOTTOM SIDE
OF PC BOARD
HOT AIR KNIFE
TURBULENT WAVE
FLUXING
PREHEAT
0 10 20
30
50
100
150
200
250
30 40 50
TIME – SECONDS
TEMPERATURE – C
60 70 80 90 100
TOP SIDE OF
PC BOARD
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150C (100C PCB)
SOLDER WAVE TEMPERATURE = 245C
AIR KNIFE AIR TEMPERATURE = 390C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40
SOLDER: SN63; FLUX: RMA
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE EXERTING
MECHANICAL FORCE.
