Data Sheet 4 V2.2, 2007-07-04
BGF110
SD Card Interface ESD Protection
SD Card Interface ESD Protection
Description
The BGF110 is an ESD protection for the SD Card interface using a green wafer level package. External pins are
protected up to 15 kV contact discharge according to IEC61000-4-2. A RF filter functionality provides very good
RF and EMI suppression on the digital lines with very low cross talk. Sensitivity of the line capacitance on the bias
voltage is very low. The wafer level package has a 400 µm solder ball pitch and 250 µm ball diameter (before ball
attach).
Feature
• ESD protection for SD Card interface
• Integrated ESD protection up to 15 kV contact discharge
• Very good EMI filtering with very low cross talk
• Green wafer level package with SnAgSu solder balls
•400µm solder ball pitch
Type Package Marking Chip
BGF110 WLP-24-2 BGF110 N0720
Table 1 Maximum Ratings
Parameter Symbol Values Unit Note /
Test Condition
Min. Typ. Max.
Voltage at all pins to GND
V
P
-14 14 V
Operating temperature range
T
OP
-40 +85 °C
Storage temperature range
T
STG
-65 +150 °C
Maximum current at all pins
I
max
113
1)
1) Can be applied for 24 hours if thermal power dissipation into PCB is considered properly
mA
Electrostatic discharge according to IEC61000-4-2 (contact discharge)
Ext. IOs: A4, A5, B4, B5, C4, C5, D4, D5, E4, E5
V
E
-15 15 kV
Int. IOs: A1, A2, B1, B2, C1, C2, C3, D1, D2, E1, E2
V
I
-2 2 kV
