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BGF110E6327XT

P1-P3P4-P6P7-P8
BGF110
SD Card Interface ESD Protection
Data Sheet 7 V2.2, 2007-07-04
Figure 4 Line capacitance versus bias voltage
Package Outline
Figure 5 Package WLP-24-2
BGF110_Line_capacitance.vsd
Typical line capacitance C(U)
10.5
11.0
11.5
12.0
12.5
13.0
13.5
012345678910
U [ V ]
C(U) [pF]
GWLN1132
Corner Index Area
2)
Pin A1
0.6
0.2
±0.05
STANDOFF
C
0.1
±0.05
24x
COPLANARITY
0.08
C
SEATING PLANE
C
3)
0.4
4 x 0.4 = 1.6
±0.05
2
B
0.4
±0.05
2
A
4 x 0.4 = 1.6
24x
1)
±0.04
0.25
ø0.05
M
A B
1) Dimension is measured at the maximum solder ball diameter, parallel to primary datum C
3) Primary datum C and seating plane are defined by the spherical crowns of the balls
2) Pin 1 corner identified by marking
A3A2
A1
A4 A5
B2
B1
B4 B5
C3C2
C1
C4 C5
D3D2
D1
D4 D5
E3E2
E1
E4 E5
Data Sheet 8 V2.2, 2007-07-04
BGF110
SD Card Interface ESD Protection
Tape and reel specification
Figure 6 Tape for WLP-24-2
CWLG106
5
4
±0.1
2.42
±0.05
8
2.42
±0.05
0.25
±0.1
±0.0
5
0.95
P
in 1 Corner
I
ndex Area
1)
1
) Balls face down
P1-P3P4-P6P7-P8

BGF110E6327XT

Mfr. #:
Buy BGF110E6327XT
Manufacturer:
Infineon Technologies
Description:
IC FILTER HSMMC ESD PROT WLP-24
Lifecycle:
New from this manufacturer.
Delivery:
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