16
3392F–CNFG–2/08
AT17F16
20.3 44A – TQFP
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
44A, 44-lead, 10 x 10 mm Body Size, 1.0 mm Body Thickness,
0.8 mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP)
B
44A
10/5/2001
PIN 1 IDENTIFIER
0˚~7˚
PIN 1
L
C
A1
A2 A
D1
D
e
E1 E
B
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
Notes: 1. This package conforms to JEDEC reference MS-026, Variation ACB.
2. Dimensions D1 and E1 do not include mold protrusion. Allowable
protrusion is 0.25 mm per side. Dimensions D1 and E1 are maximum
plastic body size dimensions including mold mismatch.
3. Lead coplanarity is 0.10 mm maximum.
A 1.20
A1 0.05 0.15
A2 0.95 1.00 1.05
D 11.75 12.00 12.25
D1 9.90 10.00 10.10 Note 2
E 11.75 12.00 12.25
E1 9.90 10.00 10.10 Note 2
B 0.30 0.45
C 0.09 0.20
L 0.45 0.75
e 0.80 TYP
17
3392F–CNFG–2/08
AT17F16
21. Revision History
Revision Level – Release Date History
D – March 2006 Added last-time buy for AT17F16-30CC and AT17F16-30CI.
E – August 2007
Removed -30CC and -30CI devices from ordering information.
Announced last-time buy for -30JC, -30BJC, -30JI, and -30BJI
devices.
F – February 2008
Removed -30JC, -30JI, -30BJC and -30BJI devices from ordering
information.
18
3392F–CNFG–2/08
AT17F16

AT17F16-30CU

Mfr. #:
Manufacturer:
Microchip Technology / Atmel
Description:
FPGA - Configuration Memory SERIAL CONFIG FLASH 16M - 30MHZ 8 LAP
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union