NTD85N02RT4

NTD85N02R
http://onsemi.com
4
3 V
10 V
0
0.018
40
0.014
0.006
0.002
16
0
1.6
1.2
1.4
1.0
0.8
0.6
10,000
100,000
010
40
42
V
DS
, DRAIN−TO−SOURCE VOLTAGE (VOLTS)
I
D
, DRAIN CURRENT (AMPS)
0
V
GS
, GATE−TO−SOURCE VOLTAGE (VOLTS)
Figure 1. On−Region Characteristics Figure 2. Transfer Characteristics
I
D
, DRAIN CURRENT (AMPS)
0
0.018
40
0.010
0.006
0.002
80
Figure 3. On−Resistance versus Drain Current
and Temperature
I
D
, DRAIN CURRENT (AMPS)
Figure 4. On−Resistance versus Drain Current
and Temperature
I
D
, DRAIN CURRENT (AMPS)
R
DS(on)
, DRAIN−TO−SOURCE RESISTANCE ()
R
DS(on)
, DRAIN−TO−SOURCE RESISTANCE ()
Figure 5. On−Resistance Variation with
Temperature
T
J
, JUNCTION TEMPERATURE (°C)
Figure 6. Drain−to−Source Leakage Current
versus Voltage
V
DS
, DRAIN−TO−SOURCE VOLTAGE (VOLTS)
R
DS(on)
, DRAIN−TO−SOURCE RESISTANCE
(NORMALIZED)
I
DSS
, LEAKAGE (nA)
−50 50250−25 75 125100
23
01510 2
5
5
6
V
DS
10 V
T
J
= 25°C
T
J
= −55°C
T
J
= 125°C
V
GS
= 10 V
V
GS
= 4.5 V
150
V
GS
= 0 V
I
D
= 40 A
V
GS
= 10 V
80
V
GS
= 4 V
T
J
= 25°C
T
J
= −55°C
T
J
= 125°C
T
J
= 150°C
T
J
= 125°C
40
0
160
80
45
T
J
= 25°C
T
J
= −55°C
20
100
6 V
3.2 V
5 V
1.8
6
1000
8
120
10
120
120 160
0.014
T
J
= 125°C
80
0.010
120
2.8 V
2.6 V
2.4 V
4.4 V
3.4 V
3.6 V
3.8 V
160
NTD85N02R
http://onsemi.com
5
POWER MOSFET SWITCHING
C
rss
10 0 10 15 20
GATE−TO−SOURCE OR DRAIN−TO−SOURCE VOLTAGE (VOLTS)
C, CAPACITANCE (pF)
Figure 7. Capacitance Variation
4800
1600
0
V
GS
V
DS
2400
800
55
V
GS
= 0 VV
DS
= 0 V
T
J
= 25°C
C
iss
C
oss
C
rss
C
iss
3200
4000
V
GS
Figure 8. Gate−To−Source and Drain−To−Source
Voltage versus Total Charge
V
GS
, GATE−TO−SOURCE VOLTAGE (VOLTS
)
0
2
0
Q
G
, TOTAL GATE CHARGE (nC)
6
4
1248
I
D
= 10 A
T
J
= 25°C
Q
2
Q
1
Q
T
2
0
16
Figure 9. Resistive Switching Time
Variation versus Gate Resistance
R
G
, GATE RESISTANCE (OHMS)
1 10 100
1000
1
t, TIME (ns)
100
t
r
t
d(off)
t
d(on)
t
f
10
V
DS
= 10 V
I
D
= 40 A
V
GS
= 10 V
80
0
0
V
SD
, SOURCE−TO−DRAIN VOLTAGE (VOLTS)
I
S
, SOURCE CURRENT (AMPS)
V
GS
= 0 V
Figure 10. Diode Forward Voltage versus Current
0.2 0.4 1
.0
10
20
30
0.6 0.8
40
60
50
T
J
= 25°C
70
0.1 1 10010
0.1
1000
100
10
1 ms
100 s
10 ms
dc
10 s
1
Figure 11. Maximum Rated Forward Biased
Safe Operating Area
V
DS
, DRAIN−TO−SOURCE VOLTAGE (VOLTS)
I
D
, DRAIN CURRENT (AMPS)
V
GS
= 20 V
SINGLE PULSE
T
C
= 25°C
R
DS(on)
LIMIT
THERMAL LIMIT
PACKAGE LIMIT
NTD85N02R
http://onsemi.com
6
Figure 12. Thermal Response
10
0.1
0.01
0.00001 0.0001
r(t)
, EFFECTIVE TRANSIENT THERMAL RESISTANCE
(NORMALIZED)
t, TIME (s)
1
0.001 0.01 0.1 1 10
Normalized to R
JC
at Steady State
10
0.1
0.01
0.00001 0.0001
r(t)
, EFFECTIVE TRANSIENT THERMAL RESPONSE
(NORMALIZED)
t, TIME (s)
1
0.001 0.01 0.1 1 10 100 1000
Figure 13. Thermal Response
Normalized to R
JA
at Steady State,
1 square Cu Pad, Cu Area 1.127 in
2
,
3 x 3 inch FR4 board

NTD85N02RT4

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
MOSFET N-CH 24V 12A DPAK
Lifecycle:
New from this manufacturer.
Delivery:
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Payment:
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