AO4812L_101

AO4812
30V Dual N-Channel MOSFET
General Description Product Summary
V
DS
I
D
(at V
GS
=10V) 6A
R
DS(ON)
(at V
GS
=10V) < 30m
R
DS(ON)
(at V
GS
=4.5V) < 42m
100% UIS Tested
100% R
g
Tested
Symbol
V
DS
V
GS
I
DM
I
AS
, I
AR
E
AS
, E
AR
T
J
, T
STG
Symbol
t 10s
Steady-State
Steady-State
R
θJL
mJ
Junction and Storage Temperature Range -55 to 150 °C
Power Dissipation
B
P
D
Avalanche energy L=0.1mH
C
T
A
=70°C
1.3
Units
Thermal Characteristics
Parameter Typ Max
The AO4812 uses advanced trench technology to provide
excellent R
DS(ON)
and low gate charge. The two MOSFETs
make a compact and efficient switch and synchronous
rectifier combination for use in buck converters.
V
Maximum UnitsParameter
Absolute Maximum Ratings T
A
=25°C unless otherwise noted
30V
Drain-Source Voltage 30
Gate-Source Voltage
5
T
A
=25°C
T
A
=70°C
A10
V±20
Continuous Drain
Current
6
W
2
T
A
=25°C
Avalanche Current
C
5
30
A
I
D
Maximum Junction-to-Ambient
A D
32
90
Pulsed Drain Current
C
°C/W
R
θJA
40
Maximum Junction-to-Ambient
A
48
74
62.5
Maximum Junction-to-Lead
°C/W
°C/W
SOIC-8
Top View Bottom View
Pin1
G2
D2
S2
G1
D1
S1
G1
S1
G2
S2
D1
D1
D2
D2
Top View
Rev 9: February 2011 www.aosmd.com Page 1 of 5
AO4812
Symbol Min Typ Max Units
BV
DSS
30 V
V
DS
=30V, V
GS
=0V 1
T
J
=55°C 5
I
GSS
±100 nA
V
GS(th)
Gate Threshold Voltage
1.2 1.8 2.4 V
I
D(ON)
30 A
25 30
T
J
=125°C 40 48
33 42 m
g
FS
15 S
V
SD
0.76 1 V
I
S
2.5 A
C
iss
255 310 pF
C
oss
45 pF
C
rss
35 50 pF
R
g
1.6 3.25 4.9
Q
g(10V)
5.2 6.3 nC
Qg
(4.5V)
2.55 3.2 nC
Q
gs
0.85 nC
Q
gd
1.3 nC
t
D(on)
4.5 ns
t
r
2.5 ns
t
D(off)
14.5 ns
t
f
3.5 ns
t
rr
8.5 ns
Q
rr
2.2
nC
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Input Capacitance
Output Capacitance
Turn-On Rise Time
I
F
=6A, dI/dt=100A/µs
V
GS
=0V, V
DS
=15V, f=1MHz
SWITCHING PARAMETERS
Body Diode Reverse Recovery Charge
V
DS
=V
GS
I
D
=250µA
V
GS
=4.5V, I
D
=5A
Forward Transconductance
Body Diode Reverse Recovery Time
V
GS
=10V, I
D
=6A
Reverse Transfer Capacitance
I
F
=6A, dI/dt=100A/µs
Maximum Body-Diode Continuous Current
m
V
GS
=10V, V
DS
=15V, R
L
=2.5,
R
GEN
=3
DYNAMIC PARAMETERS
Turn-Off DelayTime
Turn-On DelayTime
Gate resistance
V
GS
=0V, V
DS
=0V, f=1MHz
V
DS
=5V, I
D
=6A
R
DS(ON)
Static Drain-Source On-Resistance
I
DSS
µA
Zero Gate Voltage Drain Current
Turn-Off Fall Time
Total Gate Charge
V
GS
=10V, V
DS
=15V, I
D
=6A
Gate Source Charge
Gate Drain Charge
I
S
=1A,V
GS
=0V
Diode Forward Voltage
Electrical Characteristics (T
J
=25°C unless otherwise noted)
STATIC PARAMETERS
Parameter Conditions
Drain-Source Breakdown Voltage
On state drain current
I
D
=-250µA, V
GS
=0V
V
GS
=10V, V
DS
=5V
V
DS
=0V, V
GS
20V
Gate-Body leakage current
A. The value of R
θJA
is measured with the device mounted on 1in
2
FR-4 board with 2oz. Copper, in a still air environment with T
A
=25°C. The
value in any given application depends on the user's specific board design.
B. The power dissipation P
D
is based on T
J(MAX)
=150°C, using 10s junction-to-ambient thermal resistance.
C. Repetitive rating, pulse width limited by junction temperature T
J(MAX)
=150°C. Ratings are based on low frequency and duty cycles to keep
initialT
J
=25°C.
D. The R
θJA
is the sum of the thermal impedence from junction to lead R
θJL
and lead to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-ambient thermal impedence which is measured with the device mounted on 1in
2
FR-4 board with
2oz. Copper, assuming a maximum junction temperature of T
J(MAX)
=150°C. The SOA curve provides a single pulse ratin g.
Rev 9: February 2011 www.aosmd.com Page 2 of 5
AO4812
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
17
5
2
10
0
18
40
0
5
10
15
1 1.5 2 2.5 3 3.5 4 4.5
V
GS
(Volts)
Figure 2: Transfer Characteristics (Note E)
I
D
(A)
20
25
30
35
40
0 3 6 9 12 15
I
D
(A)
Figure 3: On-Resistance vs. Drain Current and
Gate Voltage (Note E)
R
DS(ON)
(m
)
1.0E-05
1.0E-04
1.0E-03
1.0E-02
1.0E-01
1.0E+00
1.0E+01
1.0E+02
0.0 0.2 0.4 0.6 0.8 1.0 1.2
V
SD
(Volts)
Figure 6: Body-Diode Characteristics (Note E)
I
S
(A)
25°C
125°C
0.8
1
1.2
1.4
1.6
1.8
0 25 50 75 100 125 150 175
Temperature C)
Figure 4: On-Resistance vs. Junction Temperature
(Note E)
Normalized On-Resistance
V
GS
=10V
I
D
=6A
V
GS
=4.5V
I
D
=5A
20
40
60
80
100
2 4 6 8 10
V
GS
(Volts)
Figure 5: On-Resistance vs. Gate-Source Voltage
(Note E)
R
DS(ON)
(m
)
25°C
125°C
V
DS
=5V
V
GS
=4.5V
I
D
=6A
25°C
125°C
0
5
10
15
20
25
30
0 1 2 3 4 5
V
DS
(Volts)
Fig 1: On-Region Characteristics (Note E)
I
D
(A)
V
GS
=3V
7V
10V
3.5V
4V
4.5V
V
GS
=10V
Rev 9: February 2011 www.aosmd.com Page 3 of 5

AO4812L_101

Mfr. #:
Manufacturer:
Description:
MOSFET 2N-CH 30V 6A
Lifecycle:
New from this manufacturer.
Delivery:
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