BUK7L11-34ARC,127

1. Product profile
1.1 General description
N-channel enhancement mode field-effect power transistor in a plastic package using
Philips General-Purpose Automotive (GPA) TrenchMOS technology.
1.2 Features
1.3 Applications
1.4 Quick reference data
2. Pinning information
BUK7L11-34ARC
TrenchPLUS standard level FET
Rev. 04 — 16 December 2005 Product data sheet
ESD and clamping diodes Q101 compliant
175 °C rated Internal gate resistor
Automotive systems General purpose power switching
Motors, lamps and solenoids 12 V loads
E
DS(CL)S
465 mJ R
DSon
=8m (typ)
I
D
75 A P
tot
172 W
Table 1: Pinning
Pin Description Simplified outline Symbol
1 gate (G)
SOT78C (TO-220)
2 drain (D)
3 source (S)
mb mounting base;
connected to drain (D)
12
mb
mbl370
3
mbl521
D
S
G
BUK7L11-34ARC_4 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 04 — 16 December 2005 2 of 14
Philips Semiconductors
BUK7L11-34ARC
TrenchPLUS standard level FET
3. Ordering information
4. Limiting values
[1] Voltage is limited by clamping.
[2] Current is limited by power dissipation chip rating.
[3] Continuous current is limited by package.
[4] Refer to document
9397 750 12572
for further information.
Table 2: Ordering information
Type number Package
Name Description Version
BUK7L11-34ARC 3-lead TO-220 Plastic single-ended package; heatsink mounted; 1 mounting hole; 3 leads SOT78C
Table 3: Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
DS
drain-source voltage (DC)
[1]
-34V
V
DGR
drain-gate voltage (DC) R
GS
=20k
[1]
-34V
V
GS
gate-source voltage (DC) - ±20 V
I
D
drain current (DC) T
mb
=25°C; V
GS
=10V;
Figure 2 and 3
[2] [4]
-89A
[3]
-75A
T
mb
= 100 °C; V
GS
=10V;Figure 2 -63A
I
DM
peak drain current T
mb
=25°C; pulsed; t
p
10 µs; Figure 3 - 358 A
P
tot
total power dissipation T
mb
=25°C; Figure 1 - 172 W
I
DG(CL)
drain-gate clamping current t
p
= 5 ms; δ = 0.01 - 50 mA
I
GS(CL)
gate-source clamping current continuous - 10 mA
t
p
= 5 ms; δ = 0.01 - 50 mA
T
stg
storage temperature 55 +175 °C
T
j
junction temperature 55 +175 °C
Source-drain diode
I
DR
reverse drain current (DC) T
mb
=25°C
[2] [4]
-89A
[3]
-75A
I
DRM
peak reverse drain current T
mb
=25°C; pulsed; t
p
10 µs - 358 A
Avalanche ruggedness
E
DS(CL)S
non-repetitivedrain-source clamped
energy
unclamped inductive load; I
D
=60A;
V
DS
34 V; V
GS
=10V;
starting at T
j
=25°C
- 465 mJ
Electrostatic discharge
V
esd
electrostatic discharge voltage; all
pins
human body model; C = 100 pF;
R = 1.5 k
-8kV
human body model; C = 250 pF;
R = 1.5 k
-6kV
BUK7L11-34ARC_4 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 04 — 16 December 2005 3 of 14
Philips Semiconductors
BUK7L11-34ARC
TrenchPLUS standard level FET
V
GS
10 V
(1) Capped at 75 A due to package.
Fig 1. Normalized total power dissipation as a
function of mounting base temperature
Fig 2. Continuous drain current as a function of
mounting base temperature
T
mb
=25°C; I
DM
is single pulse.
(1) Capped at 75 A due to package.
Fig 3. Safe operating area; continuous and peak drain currents as a function of drain-source voltage
03aa16
0
40
80
120
0 50 100 150 200
T
mb
(
°
C)
P
der
(%)
03nj52
0
20
40
60
80
100
0 50 100 150 200
T
mb
(
°
C)
I
D
(A)
(1)
P
der
P
tot
P
tot 25 C
°
()
------------------------
100 %×=
03nj50
1
10
10
2
10
3
1 10 10
2
V
DS
(V)
I
D
(A)
DC
100 ms
10 ms
Limit R
DSon
= V
DS
/ I
D
1 ms
t
p
= 10
µ
s
100
µ
s
(1)

BUK7L11-34ARC,127

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
MOSFET N-CH 34V 75A TO220AB
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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