MPX5700
Sensors
4 Freescale Semiconductor, Inc.
Pressure
On-chip Temperature Compensation and Calibration
Figure 3. illustrates both the Differential/Gauge and the
Absolute Sensing Chip in the basic chip carrier (Case 867).
A fluorosilicone gel isolates the die surface and wire bonds
from the environment, while allowing the pressure signal to
be transmitted to the sensor diaphragm. (For use of the
MPX5700D in a high-pressure cyclic application, consult the
factory.)
The MPX5700 series pressure sensor operating
characteristics, and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media,
other than dry air, may have adverse effects on sensor
performance and long-term reliability. Contact the factory for
information regarding media compatibility in your application.
Figure 2. shows the sensor output signal relative to
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
0 to 85C using the decoupling circuit shown in . The output
will saturate outside of the specified pressure range.
shows the recommended decoupling circuit for interfacing
the output of the integrated sensor to the A/D input of a
microprocessor or microcontroller. Proper decoupling of the
power supply is recommended.
Figure 2. Output vs. Pressure Differential
Figure 3. Cross-Sectional Diagrams (not to scale)
Figure 4. Recommended Power Supply Decoupling and Output Filtering
(For additional output filtering, please refer to Application Note AN1646)
Differential Pressure (kPa)
Output (V)
Typical
Minimum
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
0
100
200
300
400
600500
Maximum
700 800
Transfer Function:
V
out
= V
S
*(0.0012858*P+0.04) ± Error
V
S
= 5.0 Vdc
Temperature = 0 to 85
°C
Fluoro Silicone
Die Coat
Wire Bond
Die
P1
Stainless Steel
Metal Cover
Lead Frame
RTV Die
Bond
Epoxy Case
P2
Fluoro Silicone
Die Coat
Wire Bond
Die
P1
Stainless Steel
Metal Cover
Lead Frame
RTV Die
Bond
Epoxy Case
P2
ABSOLUTE ELEMENTDIFFERENTIAL/GAUGE ELEMENT
+5 V
1.0 F
0.01 F
470 pFGND
V
s
V
out
IPS
Output
MPX5700
Sensors
Freescale Semiconductor, Inc. 5
Pressure
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing fluorosilicone gel
which protects the die from harsh media. The Freescale MPX
pressure sensor is designed to operate with positive
differential pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
following table.
Part Number Case Type
Pressure (P1)
Side Identifier
MPX5700A/D 867 Stainless Steel Cap
MPX5700DP 867C Side with Part Marking
MPX5700GP/AP 867B Side with Port Attached
MPX5700GS/AS 867E Side with Port Attached
MPX5700ASX 867F Side with Port Attached
MPX5700
Sensors
6 Freescale Semiconductor, Inc.
Pressure
PACKAGE DIMENSIONS
CASE 867-08
ISSUE N
BASIC ELEMENT
NOTES:
1.
2.
DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
CONTROLLING DIMENSION: INCH.
R
X
123456
PORT #2 VACUUM (P2)
PORT #1 POSITIVE
PRESSURE (P1)
PORT #1
POSITIVE
PRESSURE
(P1)
PIN 1
PORT #2
VACUUM
(P2)
SEATING
PLANE
SEATING
PLANE
-T- -T-
P
G
C
J
N
B
F
D
6 PL
W
V
L
U
S
K
-Q-
-A-
M
Q
M
0.25 (0.010) T
M
A
M
0.13 (0.005)
STYLE 1:
PIN 1. V
OUT
2. GROUND
3. V
CC
4. V1
5. V2
6. V
EX
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 1.145 1.175 29.08 29.85
B 0.685 0.715 17.40 18.16
C 0.405 0.435 10.29 11.05
D 0.027 0.033 0.68 0.84
F 0.048 0.064 1.22 1.63
G 0.100 BSC 2.54 BSC
J 0.014 0.016 0.36 0.41
K 0.695 0.725 17.65 18.42
L 0.290 0.300 7.37 7.62
N 0.420 0.440 10.67 11.18
P 0.153 0.159 3.89 4.04
Q 0.153 0.159 3.89 4.04
R 0.063 0.083 1.60 2.11
S
U 0.910 BSC 23.11 BSC
V 0.182 0.194 4.62 4.93
W 0.310 0.330 7.87 8.38
X 0.248 0.278 6.30 7.06
0.220 0.240 5.59 6.10
CASE 867C-05
ISSUE F
PRESSURE AND VACUUM SIDES PORTED (DP)

MPX5700AP

Mfr. #:
Manufacturer:
NXP / Freescale
Description:
Board Mount Pressure Sensors INTEGRATED PRESSURE SENSR
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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