SM6T Characteristics
Doc ID 3082 Rev 9 5/10
Figure 6. Capacitance versus reverse
applied voltage for unidirectional
types (typical values)
Figure 7. Capacitance versus reverse applied
voltage for bidirectional types
(typical values)
C (pF)
10
100
1000
10000
1 10 100 1000
F=1 MHz
V
osc
=30 mV
RMS
T
j
=25 °C
SM6T6V8A
SM6T15A
SM6T30A
SM6T68A
SM6T100A
SM6T220A
V(V)
R
C (pF)
10
100
1000
10000
1 10 100 1000
F=1 MHz
V
osc
=30 mV
RMS
T
j
=25 °C
SM6T6V8CA
SM6T15CA
SM6T30CA
SM6T68CA
SM6T100CA
SM6T220CA
V(V)
R
Figure 8. Peak forward voltage drop versus
peak forward current
(typical values)
Figure 9. Relative variation of thermal
impedance junction to ambient
versus pulse duration
1.0E-02
1.0E-01
1.0E+00
1.0E+01
1.0E+02
0.0 0.5 1.0 1.5 2.0 2.5 3.0
I
FM
(A)
T
j
=25 °C
T
j
=125 °C
V
FM
(V)
Zth (j-a)/Rth (j-a)
0.01
0.10
1.00
1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01 1.0E+02 1.0E+03
Recommended pad layout
Printed circuit board FR4, copper thickness = 35 µm
s
tp
Figure 10. Thermal resistance junction to
ambient versus copper surface
under each lead
Figure 11. Leakage current versus junction
temperature (typical values)
0
10
20
30
40
50
60
70
80
90
100
110
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R
th(j-a)
(°C/W)
(printed circuit board FR4,
copper thickness = 35 µm)
S
Cu
(cm²)
I
R
(nA)
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
25 50 75 100 125 150
V
R
=V
RM
V
RM
≥ 10 V
V
R
=V
RM
V
RM
< 10 V
T (° C)
j
