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TLP3825F(F

P1-P3P4-P6P7-P9P10-P12P13-P13
TLP3825,TLP3825F
4
9.
9.
9.
9. Recommended Operating Conditions (Note)
Recommended Operating Conditions (Note)
Recommended Operating Conditions (Note)
Recommended Operating Conditions (Note)
Characteristics
Supply voltage
Input forward current
ON-state current (A connection)
Operating temperature
Symbol
V
DD
I
F
I
ON
T
opr
Note Min
-40
Typ.
5
Max
160
25
1.5
85
Unit
V
mA
A
Note: The recommended operating conditions are given as a design guide necessary to obtain the intended
performance of the device. Each parameter is an independent value. When creating a system design using
this device, the electrical characteristics specified in this data sheet should also be considered.
10.
10.
10.
10. Electrical Characteristics (Unless otherwise specified, T
Electrical Characteristics (Unless otherwise specified, T
Electrical Characteristics (Unless otherwise specified, T
Electrical Characteristics (Unless otherwise specified, T
a
a
a
a
= 25
= 25
= 25
= 25
)
)
)
)
LED
Detector
Characteristics
Input forward voltage
Input reverse current
Input capacitance
OFF-state current
Output capacitance
Symbol
V
F
I
R
C
t
I
OFF
C
OFF
Note Test Condition
I
F
= 10 mA
V
R
= 5 V
V = 0 V, f = 1 MHz
V
OFF
= 200 V
V = 0 V, f = 1 MHz
Min
1.50
Typ.
1.64
70
0.1
400
Max
1.80
10
1
Unit
V
µA
pF
µA
pF
11.
11.
11.
11. Coupled Electrical Characteristics (Unless otherwise specified, T
Coupled Electrical Characteristics (Unless otherwise specified, T
Coupled Electrical Characteristics (Unless otherwise specified, T
Coupled Electrical Characteristics (Unless otherwise specified, T
a
a
a
a
= 25
= 25
= 25
= 25
)
)
)
)
Characteristics
Trigger LED current
Return LED current
ON-state resistance (A connection)
ON-state resistance (B connection)
ON-state resistance (C connection)
Symbol
I
FT
I
FC
R
ON
Note
(Note 1)
Test Condition
I
ON
= 1 A
I
OFF
= 1 µA
I
ON
= 1 A, I
F
= 5 mA, t < 1 s
I
ON
= 1 A, I
F
= 5 mA, t < 1 s
I
ON
= 1 A, I
F
= 5 mA, t < 1 s
Min
0.01
Typ.
0.3
250
130
Max
5.0
500
250
250
Unit
mA
mΩ
Note 1: For an application circuit example, see Chapter 14.1.
12.
12.
12.
12. Isolation Characteristics (Unless otherwise specified, T
Isolation Characteristics (Unless otherwise specified, T
Isolation Characteristics (Unless otherwise specified, T
Isolation Characteristics (Unless otherwise specified, T
a
a
a
a
= 25
= 25
= 25
= 25
)
)
)
)
Characteristics
Total capacitance (input to output)
Isolation resistance
Isolation voltage
Symbol
C
S
R
S
BV
S
Note
(Note 1)
(Note 1)
(Note 1)
Test Condition
V
S
= 0 V, f = 1 MHz
V
S
= 500 V, R.H. ≤ 60 %
AC, 60 s
AC, 1 s in oil
DC, 60 s in oil
Min
5×10
10
2500
Typ.
0.8
10
14
5000
5000
Max
Unit
pF
Ω
Vrms
Vdc
Note 1: This device is considered as a two-terminal device: Pins 1, 2, 3 and 4 are shorted together, and pins 5, 6, 7
and 8 are shorted together.
13.
13.
13.
13. Switching Characteristics (Unless otherwise specified, T
Switching Characteristics (Unless otherwise specified, T
Switching Characteristics (Unless otherwise specified, T
Switching Characteristics (Unless otherwise specified, T
a
a
a
a
= 25
= 25
= 25
= 25
)
)
)
)
Characteristics
Turn-on time
Turn-off time
Symbol
t
ON
t
OFF
Note Test Condition
See Fig. 13.1.
R
L
= 200 Ω, V
DD
= 20 V, I
F
= 5 mA
Min
Typ.
0.25
0.1
Max
5.0
1.0
Unit
ms
Fig.
Fig.
Fig.
Fig. 13.1
13.1
13.1
13.1 Switching Time Test Circuit and Waveform
Switching Time Test Circuit and Waveform
Switching Time Test Circuit and Waveform
Switching Time Test Circuit and Waveform
2017-09-26
Rev.2.0
©2016-2017
Toshiba Electronic Devices & Storage Corporation
TLP3825,TLP3825F
5
14.
14.
14.
14. Characteristics Curves and Circuit Connections
Characteristics Curves and Circuit Connections
Characteristics Curves and Circuit Connections
Characteristics Curves and Circuit Connections
14.1.
14.1.
14.1.
14.1. Circuit Connections
Circuit Connections
Circuit Connections
Circuit Connections
Fig.
Fig.
Fig.
Fig. 14.1.1
14.1.1
14.1.1
14.1.1 A Connection
A Connection
A Connection
A Connection Fig.
Fig.
Fig.
Fig. 14.1.2
14.1.2
14.1.2
14.1.2 B Connection
B Connection
B Connection
B Connection
Fig.
Fig.
Fig.
Fig. 14.1.3
14.1.3
14.1.3
14.1.3 C Connection
C Connection
C Connection
C Connection
2017-09-26
Rev.2.0
©2016-2017
Toshiba Electronic Devices & Storage Corporation
TLP3825,TLP3825F
6
15.
15.
15.
15. Soldering and Storage
Soldering and Storage
Soldering and Storage
Soldering and Storage
15.1.
15.1.
15.1.
15.1. Precautions for Soldering
Precautions for Soldering
Precautions for Soldering
Precautions for Soldering
The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective
of whether a soldering iron or a reflow soldering method is used.
• When using soldering reflow.
The soldering temperature profile is based on the package surface temperature.
(See the figure shown below, which is based on the package surface temperature.)
Reflow soldering must be performed once or twice.
The mounting should be completed with the interval from the first to the last mountings being 2 weeks.
Fig.
Fig.
Fig.
Fig. 15.1.1
15.1.1
15.1.1
15.1.1 An Example of a Temperature Profile When Lead(Pb)-Free Solder Is Used
An Example of a Temperature Profile When Lead(Pb)-Free Solder Is Used
An Example of a Temperature Profile When Lead(Pb)-Free Solder Is Used
An Example of a Temperature Profile When Lead(Pb)-Free Solder Is Used
• When using soldering flow
Preheat the device at a temperature of 150 (package surface temperature) for 60 to 120 seconds.
Mounting condition of 260 within 10 seconds is recommended.
Flow soldering must be performed once.
• When using soldering Iron
Complete soldering within 10 seconds for lead temperature not exceeding 260 or within 3 seconds not
exceeding 350
Heating by soldering iron must be done only once per lead.
15.2.
15.2.
15.2.
15.2. Precautions for General Storage
Precautions for General Storage
Precautions for General Storage
Precautions for General Storage
• Avoid storage locations where devices may be exposed to moisture or direct sunlight.
• Follow the precautions printed on the packing label of the device for transportation and storage.
• Keep the storage location temperature and humidity within a range of 5 to 35 and 45 % to 75 %,
respectively.
• Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty
conditions.
• Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during
storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the
solderability of the leads.
• When restoring devices after removal from their packing, use anti-static containers.
• Do not allow loads to be applied directly to devices while they are in storage.
• If devices have been stored for more than two years under normal storage conditions, it is recommended
that you check the leads for ease of soldering prior to use.
2017-09-26
Rev.2.0
©2016-2017
Toshiba Electronic Devices & Storage Corporation
P1-P3P4-P6P7-P9P10-P12P13-P13

TLP3825F(F

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Buy TLP3825F(F
Manufacturer:
Toshiba
Description:
MOSFET Output Optocouplers Photorelay 1.5A 200V 2500Vrms 400pF 5mA
Lifecycle:
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