AEDR-8502-102

7
Encoder Placement Orientation and Positioning
The AEDR-850X is designed such that both the emitter and detector IC should be placed parallel to the window/bar
orientation, as shown (with the encoder mounted on top of the codewheel. See view below).
Most importantly,
the center of the lens of the encoder unit; needs to be in line with the operating radius of the codewheel
(R
OP
) or rather the center point of Lw (0.5 of the Length of Window). Lw is recommended to be 1.8 mm or greater.
Top View
Codewheel
Placement orientation of
the encoder’s on the codewheel
Note: Drawing not to scale
Emitter
Detector
Codewheel
Direction of Movement
With the detector side of the encoder placed closer to the codewheel centre, see the above top view; Channel A leads Channel
B when the codewheel rotates anti-clockwise and vice versa (with the encoder mounted on top of the codewheel).
The optimal gap setting recommended is between 0.5 to 1.25 mm (See side view below).
Side View
Gap = 0.5 to 1.25 mm
(1.0mm nominal)
Encoder height = 0.9562 mm
Codewheel
Note: Drawing not to scale.
Anti-clockwise
Ch. A leads
Ch. B
Ch. B leads
Ch. A
Emitter
Codewheel
Clockwise
Emitter
Codewheel
Top
View
8
Recommended Land Pattern for AEDR-850X
Moisture Sensitivity Level
The AEDR-850X is speci ed to moisture sensitive level (MSL) 3. Precaution is required to handle this moisture sensitive
product to ensure the reliability of the product.
Storage before use
- Un-open moisture barrier bag (MBB) can be stored at <40’C/90% RH for 12 months.
- It is not recommended to open the MBB prior to assembly.
Control after open the MBB
- Encoder that will be subjected to re ow solder must mounted within 168hrs of factory condition <30’C/60% RH
Control for un nished reel
- Stored and sealed MBB with desiccant or desiccators at <5% RH.
Baking is required if :
- Humidity indicator card (HIC) is >10% when read at 23±5°C
- The encoder  oor life exceeded 168 hours.
- Recommended baking condition : 60±5°C for 20 hours (tape and reel)
125 ±5°C for 5 hours (loose unit)
Note: General tolerance ±0.05mm
Package outline
2X 1.9
3.40
3.95
2X 2.45
8X 0.80
2X 3.00
8X 0.35
2X 1.8
9
Recommended Lead-free Re ow Soldering Temperature Pro le
Maximum ramp up rate = 3°C/sec
Maximum ramp down rate = 6°C/sec
Preheat temperature = 150°C to 200°C
Preheat time = 60 to 100 sec
Time maintain above 217° C = 40 to 60 sec
Peak Temperature = 235°C
Time within 5° C of peak temperature = 20 to 30 sec
Note:
1. Re ow with peak temperature > 235°C may cause damage to the component.
2. Due to treatment of high temperature, this clear compound may turn yellow
after IR re ow.
3. Pro le shown here is the actual readings from the thermocouple (attached
to AEDR-850x as shown to the right) on the re ow board PCB.
0
50
100
150
200
250
0 25 50 60 75 100 125 150 175 200 225 250 275 300 324 354
Preheat Zone
Liquidus point 217 °C
60 sec Max
Max 235 °C
Tape and Reel Information
Mold
Compound
IC
Reow PCB
Thermocouple
LED

AEDR-8502-102

Mfr. #:
Manufacturer:
Broadcom / Avago
Description:
Optical Switches, Reflective, Photo IC Output Reflective Encoder 3 Ch w/ Interpolator
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union