Philips Semiconductors Product data sheet
PCA9512Level shifting hot swappable I
2
C and SMBus buffer
2004 Oct 05
7
Hot Swapping and Capacitance Buffering
Application
Figures 7 through 9 illustrate the usage of the PCA9512 in
applications that take advantage of both its hot swapping and
capacitance buffering features. In all of these applications, note that
if the I/O cards were plugged directly into the backplane, all of the
backplane and card capacitances would add directly together,
making rise- and fall-time requirements difficult to meet. Placing a
PCA9512 on the edge of each card, however, isolates the card
capacitance from the backplane. For a given I/O card, the PCA9512
drives the capacitance of everything on the card and the backplane
must drive only the the capacitance of the bus buffer, which is less
than 10 pF, the connector, trace, and all additional cards on the
backplane.
See Application Note
AN10160, Hot Swap Bus Buffer
for more
information on applications and technical assistance.
C1
0.01 µF
R4
10 k
R5
10 k
POWER SUPPLY
HOT SWAP
I/O PERIPHERAL CARD 1
R6
10 k
R3 5.1
C2
0.01 µF
V
CC
V
CC2
SDAIN
SCLIN
SDAOUT
SCLOUT
ACC
GND
CARD1_SDA
CARD1_SCL
PCA9512
C3
0.01 µF
R8
10 k
R9
10 k
POWER SUPPLY
HOT SWAP
I/O PERIPHERAL CARD 2
R10
10 k
R7 5.1
C4
0.01 µF
V
CC
V
CC2
SDAIN
SCLIN
SDAOUT
SCLOUT
ACC
GND
CARD2_SDA
CARD2_SCL
PCA9512
C5
0.01 µF
R12
10 k
R13
10 k
POWER SUPPLY
HOT SWAP
I/O PERIPHERAL CARD N
R14
10 k
C6
0.01 µF
V
CC
V
CC2
SDAIN
SCLIN
SDAOUT
SCLOUT
ACC
GND
CARDN_SDA
CARDN_SCL
PCA9512
R1
10 k
R2
10 k
V
CC2
V
CC
SDA
SCL
BD_SEL
BACKPLANE
BACKPLANE
CONNECTOR
SW02117
R11 5.1
STAGGERED CONNECTORSTAGGERED CONNECTORSTAGGERED CONNECTOR
NOTE: Application assumes bus capacitance within “proper operation” region of Figures 5 and 6.
Figure 7. Hot swapping multiple I/O cards into a backplane using the PCA9512 in a CompactPCI, VME, and AdvancedTCA system
Philips Semiconductors Product data sheet
PCA9512Level shifting hot swappable I
2
C and SMBus buffer
2004 Oct 05
8
C1
0.01 µF
R4
10 k
R5
10 k
I/O PERIPHERAL CARD 1
R6
10 k
R3 5.1
C2
0.01 µF
V
CC
V
CC2
SDAIN
SCLIN
SDAOUT
SCLOUT
ACC
GND
CARD1_SDA
CARD1_SCL
PCA9512
C3
0.01 µF
R8
10 k
R9
10 k
I/O PERIPHERAL CARD 2
R10
10 k
R4 5.1
C4
0.01 µF
V
CC
V
CC2
SDAIN
SCLIN
SDAOUT
SCLOUT
ACC
GND
CARD2_SDA
CARD2_SCL
PCA9512
R1
10 k
R2
10 k
V
CC2
V
CC
SDA
SCL
BACKPLANE
BACKPLANE
CONNECTOR
SW02118
STAGGERED CONNECTORSTAGGERED CONNECTOR
NOTE: Application assumes bus capacitance within “proper operation” region of Figures 5 and 6.
Figure 8. Hot swapping multiple I/O cards into a backplane using the PCA9512 with a custom connector
C1
0.01 µF
R3
10 k
R2
10 k
V
CC
V
CC2
SDAIN
SCLIN
SDAOUT
SCLOUT
ACC
GND
CARD_SDA
CARD_SCL
PCA9512
C2
0.01 µF
R4
10 k
R1
10 k
V
CC
5 V CARD_V
CC
, 3 V
SCL
SCL
SW02119
NOTE: Application assumes bus capacitance within “proper operation” region of Figures 5 and 6.
Figure 9. 5 V to 3.3 V level translator and bus buffer
Philips Semiconductors Product data sheet
PCA9512Level shifting hot swappable I
2
C and SMBus buffer
2004 Oct 05
9
ABSOLUTE MAXIMUM RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134).
Voltages with respect to pin GND.
LIMITS
SYMBOL PARAMETER MIN. MAX. UNIT
V
CC
Supply voltage range V
CC
–0.5 +7 V
V
CC2
Supply voltage range V
CC2
–0.5 +7 V
V
n
SDAIN, SCLIN, SDAOUT, SCLOUT, ACC –0.5 +7 V
I
I
Maximum current for inputs ± 20 mA
I
IO
Maximum current for I/O pins ± 50 mA
T
opr
Operating temperature range –40 +85 °C
T
stg
Storage temperature range –65 +125 °C
T
sld
Lead soldering temperature (10 sec max) +300 °C
T
j(max)
Maximum junction temperature +125 °C
NOTE:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability.

PCA9512D,112

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
IC BUFFER I2C/SMBUS HOTSWAP 8SO
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet