MBRS2H100T3G, NBRS2H100T3G, MBRA2H100T3G, NRVBA2H100T3G
www.onsemi.com
4
TYPICAL CHARACTERISTICS
Square Wave
dc
dc
Figure 7. Current Derating, Ambient
I
O
, AVERAGE FORWARD CURRENT (A)
43210
0
1
2
3
4
5
P
FO
, AVERAGE POWER DISSIPATION (W)
T
J
= 175°C
dc
Square Wave
Figure 8. Maximum Forward Power Dissipation
T
A
, AMBIENT TEMPERATURE (°C)
160140100400
0
1.0
2.0
3.0
4.0
F(AV)
, AVERAGE FORWARD CURRENT (A)
R
q
JA
= 71°C/W
80
R
q
JA
= 100°C/W
0.10.00001
PULSE TIME (s)
100
10
0.1
0.01
0.001
0.0001 0.001 0.01 1.0
10 1000.000001
50% (DUTY CYCLE)
20%
10%
5.0%
2.0%
1.0%
SINGLE PULSE
1000
R(t) (C/W)
Figure 9. Thermal Response, Junction−to−Ambient (1 inch pad) − MBRS2H100T3G/NBRS2H100T3G
1.0
20 60 120 175
SMB Die X 1.8 mm Die Y 1.8 mm
PCB Cu Area 645.2 mm
2
PCB Cu thk 1.0 oz
0.10.00001
PULSE TIME (s)
100
10
0.1
0.01
0.0001 0.001 0.01 1.0
10 1000.000001
50% (DUTY CYCLE)
20%
10%
5.0%
2.0%
1.0%
SINGLE PULSE
1000
R(t) (C/W)
Figure 10. Thermal Response, Junction−to−Ambient (min pad) − MBRS2H100T3G/NBRS2H100T3G
1.0
1000
SMB Die X 1.8 mm Die Y 1.8 mm
PCB Cu Area 11.8 mm
2
PCB Cu thk 1.0 oz
