NTNUS3171PZ
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5
PACKAGE DIMENSIONS
SOT−1123
CASE 524AA−01
ISSUE B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
DIM MIN NOM MAX
MILLIMETERS
A 0.34 0.37 0.40
b 0.15 0.22 0.28
c 0.07 0.12 0.17
D 0.75 0.80 0.85
E 0.55 0.60 0.65
0.95 1.00 1.05
L 0.05 0.10 0.15
H
E
0.013 0.015 0.016
0.006 0.009 0.011
0.003 0.005 0.007
0.030 0.031 0.033
0.022 0.024 0.026
0.037 0.039 0.041
0.002 0.004 0.006
MIN NOM MAX
INCHES
D
E
b
c
A
L
−Y−
−X−
0.08 (0.0032)
XY
H
E
0.40
0.30
0.90
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
e −−− −−−−
b1 0.10 0.15 0.20 0.004 0.006 0.008
b1
e
0.35
0.25
1
2
3
0.35 0.40
0.014 0.016
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