Data Sheet ADG5412W
CONTINUOUS CURRENT PER CHANNEL, Sx OR Dx
Table 5.
Parameter 25°C 85°C 125°C Unit
CONTINUOUS CURRENT, Sx OR Dx
V
DD
= +15 V, V
SS
= −15 V
TSSOP
JA
= 112.6°C/W) 89 59 37 mA maximum
LFCSP
JA
= 30.4°C/W) 160 94 49 mA maximum
V
DD
= +20 V, V
SS
= −20 V
TSSOP
JA
= 112.6°C/W) 95 63 39 mA maximum
LFCSP
JA
= 30.4°C/W) 170 98 50 mA maximum
V
DD
= 12 V, V
SS
= 0 V
TSSOP
JA
= 112.6°C/W) 61 43 29 mA maximum
LFCSP
JA
= 30.4°C/W) 110 70 42 mA maximum
V
DD
= 36 V, V
SS
= 0 V
TSSOP
JA
= 112.6°C/W) 80 54 35 mA maximum
LFCSP
JA
= 30.4°C/W) 144 87 47 mA maximum
Rev. A | Page 7 of 20
ADG5412W Data Sheet
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 6.
Parameter Rating
V
DD
to V
SS
48 V
V
DD
to GND −0.3 V to +48 V
V
SS
to GND +0.3 V to −48 V
Analog Inputs
1
V
SS
0.3 V to V
DD
+ 0.3 V or
30 mA, whichever occurs first
Digital Inputs
1
V
SS
0.3 V to V
DD
+ 0.3 V or
30 mA, whichever occurs first
Peak Current, Sx or Dx Pins 278 mA (pulsed at 1 ms, 10%
duty cycle maximum)
Continuous Current, Sx or Dx
2
Data + 15%
Temperature Range
Operating −40°C to +125°C
Storage −65°C to +150°C
Junction Temperature 150°C
Thermal Impedance, θ
JA
16-Lead TSSOP (4-Layer
Board)
112.6°C/W
16-Lead LFCSP (4-Layer
Board)
30.4°C/W
Reflow Soldering Peak
Temperature, Pb Free
As per JEDEC J-STD-020
1
Overvoltages at the INx, Sx, and Dx pins are clamped by internal diodes.
Limit current to the maximum ratings given.
2
See Table 5.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Only one absolute maximum rating can be applied at any
one time.
ESD CAUTION
Rev. A | Page 8 of 20
Data Sheet ADG5412W
Rev. A | Page 9 of 20
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
Figure 2. TSSOP Pin Configuration
Figure 3. LFCSP Pin Configuration
Table 7. Pin Function Descriptions
Pin No.
TSSOP LFCSP Mnemonic Description
1 15 IN1 Logic Control Input 1.
2 16 D1 Drain Terminal 1. This pin can be an input or output.
3 1 S1 Source Terminal 1. This pin can be an input or output.
4 2 V
SS
Most Negative Power Supply Potential.
5 3 GND Ground (0 V) Reference.
6 4 S4 Source Terminal 4. This pin can be an input or output.
7 5 D4 Drain Terminal 4. This pin can be an input or output.
8 6 IN4 Logic Control Input 4.
9 7 IN3 Logic Control Input 3.
10 8 D3 Drain Terminal 3. This pin can be an input or output.
11 9 S3 Source Terminal 3. This pin can be an input or output.
12 10 NC No Connection.
13 11 V
DD
Most Positive Power Supply Potential.
14 12 S2 Source Terminal 2. This pin can be an input or output.
15 13 D2 Drain Terminal 2. This pin can be an input or output.
16 14 IN2 Logic Control Input 2.
EP Exposed Pad
The exposed pad is connected internally. For increased reliability of the solder joints
and maximum thermal capability, it is recommended that the pad be soldered to the
substrate, V
SS
.
Table 8. ADG5412W Truth Table
INx Switch Condition
1 On
0 Off
11695-002
IN1
D1
S1
V
SS
IN2
D2
S2
V
DD
GND
NC
S4
S3
D4 D3
IN4
IN3
ADG5412W
TOP VIEW
(Not to Scale)
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
NOTES
1. NC = NO CONNECT.
11695-003
NOTES
1. NC = NO CONNECT.
2. THE EXPOSED PAD IS CONNECTED INTERNALLY.
FOR INCREASED RELIABILITY OF THE SOLDER
JOINTS AND MAXIMUM THERMAL CAPABILITY, IT IS
RECOMMENDED THAT THE PAD BE SOLDERED TO
THE SUBSTRATE, V
SS
.
12
11
10
1
3
4
9
2
6
5
7
8
16
15
14
13
S1
GND
S4
S2
D2
IN2
IN1
D1
NC
S3
D4
IN4
IN3
D3
V
SS
V
DD
ADG5412W
TOP VIEW
(Not to Scale)

ADG5412WBCPZ-REEL7

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Analog Switch ICs 20V Latchup Protectd of quad SPST
Lifecycle:
New from this manufacturer.
Delivery:
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