NCP51199PDR2G

NCP51199, NCV51199
www.onsemi.com
7
PACKAGE DIMENSIONS
SOIC8−NB EP
CASE 751BU
ISSUE E
SEATING
PLANE
B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION SHALL
BE 0.10mm IN EXCESS OF MAXIMUM MATERIAL
CONDITION.
4. DIMENSION D DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH,
PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15mm PER SIDE. DIMENSION E DOES
NOT INCLUDE INTERLEAD FLASH OR
PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25mm PER
SIDE. DIMENSIONS D AND E ARE DETERMINED AT
DATUM F.
5. DIMENSIONS A AND B ARE TO BE DETERMINED
AT DATUM F.
6. A1 IS DEFINED AS THE VERTICAL DISTANCE
FROM THE SEATING PLANE TO THE LOWEST
POINT ON THE PACKAGE BODY.
7. TAB CONTOUR MAY VARY MINIMALLY TO INCLUDE
TOOLING FEATURES.
A
DIM MIN MAX
MILLIMETERS
G 1.55 2.39
A 1.35 1.75
b 0.31 0.51
e 1.27 BSC
A1 0.00 0.10
b1 0.28 0.48
h 0.25 0.50
C
M
0.25
DIMENSION: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
L2 0.25 BSC
A
TOP VIEW
C0.20
A-B D
C0.10
NOTE 5
C0.10
b8X
B
C
8X
SIDE VIEW
END VIEW
DETAIL A
7.00
8X
1.52
8X
0.76
1.27
PITCH
RECOMMENDED
1
L
F
SEATING
PLANE
DETAIL A
D
L2
A1
C
NOTE 6
1
4
5
8
C0.10 A-B
NOTE 5
e
NOTE 7
F
G
BOTTOM VIEW
2.60
2.60
c 0.17 0.25
L 0.40 1.27
2X
NOTE 4
2X 4 TIPS
C0.10
2X
NOTE 4
h
c1 0.17 0.23
F 1.55 2.39
D 4.90 BSC
E 6.00 BSC
E1 3.90 BSC
E E1
D
D
B
SECTION B−B
c
c1
b
b1
NCP51199, NCV51199
www.onsemi.com
8
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NCP51199PDR2G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Linear Voltage Regulators DDR 2Amp Source Sink VTT Termination Reg
Lifecycle:
New from this manufacturer.
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