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ADG836YRMZ-REEL7

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P17
ADG836 Data Sheet
Rev. B | Page 6 of 16
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 4.
Parameter Rating
V
DD
to GND −0.3 V to +4.6 V
Analog Inputs
1
−0.3 V to V
DD
+ 0.3 V
Digital Inputs
1
−0.3 V to 4.6 V or 10 mA,
whichever occurs first
Peak Current, S or D
3.3 V Operation 500 mA
2.5 V Operation
460 mA
1.8 V Operation
420 mA (pulsed at 1ms,
10% duty cycle max)
Continuous Current, S or D
3.3 V Operation 300 mA
2.5 V Operation 275 mA
1.8 V Operation
250 mA
Operating Temperature Range
Automotive (Y Version) −40°C to +125°C
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
Thermal Impedance
MSOP
θ
JA
206°C/W
θ
JC
44°C/W
LFCSP
θ
JA
(3-Layer Board) 61.1°C/W
IR Reflow, Peak Temperature <20 sec
235°C
1
Overvoltages at IN, S, or D are clamped by internal diodes. Current should be
limited to the maximum ratings given.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Only one absolute maximum rating may be applied at any one
time.
Table 5. Truth Table
Logic Switch A Switch B
0
Off
On
1 On Off
ESD CAUTION
Data Sheet ADG836
Rev. B | Page 7 of 16
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
IN1
1
S1A
2
GND
3
S2A
4
IN2
5
D1
10
S1B
9
V
DD
8
S2B
7
D2
6
ADG836
TOP VIEW
(Not to Scale)
04308-002
Figure 2. 10-Lead MSOP Pin Configuration (RM-10)
NOTES
1. NIC = NO INTERNAL CONNECTION.
2
. IT IS RECOMMENDED THAT THE EXPOSED PAD BE THERMALLY CONNECTED
TO A COPPER PLANE FOR ENHANCED THERMAL PERFORMANCE.
THE EXPOSED PAD SHOULD BE GROUNDED AS WELL.
9
8
7
1
2
3
S1B
V
DD
S2B
S1A
GND
S2A
4
NIC
5
IN2
6
D2
12
NIC
11
IN1
10
D1
04308-003
ADG836
TOP VIEW
(Not to Scale)
Figure 3. 12-Lead LFCSP Pin Configuration (CP-12-4)
Table 6. Pin Function Descriptions
Pin No.
Mnemonic Description MSOP LFCSP
1, 5 11, 5 IN1, IN2 Logic Control Inputs.
2, 4, 7, 9 1, 3, 7, 9 S1A, S2A, S2B, S1B Source Terminals. Can be inputs or outputs.
3 2 GND Ground (0 V) Reference.
6, 10 6, 10 D2, D1 Drain Terminals. Can be inputs or outputs.
8 8 V
DD
Most Positive Power Supply Potential.
Not applicable 4, 12 NIC No Internal Connection.
Not applicable 0 EPAD
Exposed Pad. It is recommended that the exposed pad be thermally connected to a copper
plane for enhanced thermal performance. The exposed pad should be grounded as well.
ADG836 Data Sheet
Rev. B | Page 8 of 16
TYPICAL PERFORMANCE CHARACTERISTICS
0.60
0.55
0.50
0.45
ON RESISTANCE ()
0.40
0.35
0.30
0.25
0.20
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
V
D
, V
S
(V)
V
DD
= 2.7V
V
DD
= 3V
T
A
= 25°C
V
DD
= 3.6V
V
DD
= 3.3V
04449-0-004
Figure 4. On Resistance vs. V
D
(V
S
), V
DD
= 2.7 V to 3.6 V
0.8
ON RESISTANCE ()
0.3
0.4
0.5
0.6
0.7
0.2
0 0.5 2.5
04308-005
2.01.51.0
V
D
, V
S
(V)
T
A
= 25°C
V
DD
= 2.5V
V
DD
= 2.3V
V
DD
= 2.7V
Figure 5. On Resistance vs. V
D
(V
S
), V
DD
= 2.5 V to 0.2 V
1.8
ON RESISTANCE ()
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0.2
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
V
D
, V
S
(V)
T
A
= 25°C
V
DD
= 1.65V
V
DD
= 1.8V
V
DD
= 1.95V
04308-006
Figure 6. On Resistance vs. V
D
(V
S
), V
DD
= 1.8 ± 3.6
1.2
ON RESISTANCE ()
0.2
0.4
0.6
0.8
1.0
0
0 3.02.52.01.51.00.5
V
D
, V
S
(V)
+125°C
+85°C
+25°C
–40°C
V
DD
= 3.3V
04308-007
Figure 7. On Resistance vs. V
D
(V
S
) for Different Temperatures, 3.3 V
1.2
ON RESISTANCE ()
0.2
0.4
0.6
0.8
1.0
0
0 2.52.01.51.00.5
V
D
, V
S
(V)
+125°C
+25°C
V
DD
= 2.5V
+85°C
–40°C
04308-008
Figure 8. On Resistance vs. V
D
(V
S
) for Different Temperatures, 2.5 V
1.4
ON RESISTANCE ()
0.2
0.5
0.7
0.8
1.0
1.2
0
0 1.80.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
V
D
, V
S
(V)
+25°C
–40°C
+85°C
+125°C
V
DD
= 1.8V
04308-009
Figure 9. On Resistance vs. V
D
(V
S
) for Different Temperatures, 1.8 V
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P17

ADG836YRMZ-REEL7

Mfr. #:
Buy ADG836YRMZ-REEL7
Manufacturer:
Analog Devices Inc.
Description:
Analog Switch ICs Dual SPDT/2:1 Mux
Lifecycle:
New from this manufacturer.
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