NTLJS3113P
www.onsemi.com
6
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL AND
IS MEASURED BETWEEN 0.15 AND 0.20mm FROM
TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED PAD AS
WELL AS THE TERMINALS.
5. CENTER TERMINAL LEAD IS OPTIONAL. TERMINAL
LEAD IS CONNECTED TO TERMINAL LEAD # 4.
6. PINS 1, 2, 5 AND 6 ARE TIED TO THE FLAG.
C
A
SEATING
PLANE
D
B
E
0.10 C
A3
A
A1
2X
2X
0.10 C
WDFN6 2x2
CASE 506AP
ISSUE B
DIM
A
MIN MAX
MILLIMETERS
0.70 0.80
A1 0.00 0.05
A3 0.20 REF
b 0.25 0.35
b1
0.65 REF
D
D2
E
E2
0.27 REF
e
0.15 REF
K
L
PIN ONE
REFERENCE
0.08 C
0.10 C
7X
A0.10 C
NOTE 3
L
e
D2
E2
b
B
3
6
6X
1
K
4
6X
0.05 C
4X
J
J1
A0.10 C
b1
B
6X
0.05 C
L2
NOTE 5
L2
J
J1
0.51 0.61
2.00 BSC
1.00 1.20
2.00 BSC
1.10 1.30
0.65 BSC
0.20 0.30
0.20 0.30
BOTTOM VIEW
2.30
6X
PITCH
1
1.25
0.60
0.35
0.65
0.66
6X
0.43
DIMENSIONS: MILLIMETERS
1.10
0.35
0.34
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
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