NCV47821
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13
Start
Diag. OFF. Set
EN = L & DE = L
EF = ?
Diag. ON. Set
EN = L & DE = H
L
HZ
EF = ?
L
HZ
No Failure Open Load Short to Battery
Figure 20. Flowchart for Diagnostics in OFF State
I
PU
ON. Set
EN = H & DE = H
The diagnostics in OFF state shall be performed for each
channel separately. For diagnostics of Channel 1 the input
CS pin has to be put logic low, for diagnostics of Channel 2
the input CS pin has to be put logic high. Corresponding EN
pin has to be used for control (EN1 for Channel 1 and EN2
for Channel 2). For detailed information see Diagnostic
Features Truth Table in Figure 21.
Diagnostic in ON State
Diagnostic in ON State provides information about
Overcurrent or Short to Ground failures, during which the
EF output is in logic low state. The diagnostics in ON state
shall be performed for each channel separately. For
diagnostics of Channel 1 the input CS pin has to be put logic
low, for diagnostics of Channel 2 the input CS pin has to be
put logic high. For detailed information see Diagnostic
Features Truth Table in Figure 21.
Figure 21. Diagnostic Features Truth Table
13.State of EN pin of appropriate channel
14.CS = L means CH1 diagnostics and CS = H means CH2 diagnostics in OFF state (DE = H) via EF output, appropriate EN pin is used for
turning internal switch ON and OFF (e.g. when DE = H and CS = L and EN1 = L then IPU1 is OFF, when DE = H and CS = L and EN1 =
H then IPU1 is ON)
15.Internal current source turned OFF (between V
out
and V
in
of appropriate channel)
16.Internal current source turned ON (between V
out
and V
in
of appropriate channel)
17.CS = L means CH1 diagnostics and CS = H means CH2 diagnostics in ON state (e.g. when CS = L and EF = L then CH1 has Overcurrent
or Short to Ground failure, when CS = H and EF = L then CH1 has Overcurrent or Short to Ground failure)
NCV47821
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14
Thermal Considerations
As power in the device increases, it might become
necessary to provide some thermal relief. The maximum
power dissipation supported by the device is dependent
upon board design and layout. Mounting pad configuration
on the PCB, the board material, and the ambient temperature
affect the rate of junction temperature rise for the part. When
the device has good thermal conductivity through the PCB,
the junction temperature will be relatively low with high
power applications. The maximum dissipation the device
can handle is given by:
P
D(MAX)
+
ƪ
T
J(MAX)
* T
A
ƫ
R
qJA
(eq. 8)
Since T
J
is not recommended to exceed 150°C, then the
device soldered on 645 mm
2
, 1 oz copper area, FR4 can
dissipate up to 2.38 W when the ambient temperature (T
A
)
is 25°C. See Figure 22 for R
q
JA
versus PCB area. The power
dissipated by the device can be calculated from the
following equations:
P
D
[ V
in
ǒ
I
q
@I
out1,2
Ǔ
) I
out1
ǒ
V
in
−V
out1
Ǔ
) I
out2
ǒ
V
in
−V
out2
Ǔ
(eq. 9)
or
V
in(MAX)
[
P
D(MAX)
)
ǒ
V
out1
I
out1
Ǔ
)
ǒ
V
out2
I
out2
Ǔ
I
out1
) I
out2
) I
q
(eq.
10)
Figure 22. Thermal Resistance vs. PCB Copper Area
COPPER HEAT SPREADER AREA (mm
2
)
600 7005004003002001000
20
30
50
70
80
100
110
130
R
q
JA
, THERMAL RESISTANCE (°C/W)
40
60
90
120
1 oz, Single Layer
2 oz, Single Layer
1 oz, 4 Layer
2 oz, 4 Layer
Hints
V
in
and GND printed circuit board traces should be as
wide as possible. When the impedance of these traces is
high, there is a chance to pick up noise or cause the regulator
to malfunction. Place external components, especially the
output capacitor, as close as possible to the device and make
traces as short as possible.
ORDERING INFORMATION
Device Output Voltage Marking Package Shipping
NCV47821PAAJR2G Adjustable Line1: NCV4
Line2: 7821
TSSOP−14 Exposed Pad
(Pb−Free)
2500 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D
NCV47821
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15
PACKAGE DIMENSIONS
TSSOP−14 EP
CASE 948AW
ISSUE C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION SHALL BE
0.07 mm MAX. AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER RADI-
US OF THE FOOT. MINIMUM SPACE BETWEEN PRO-
TRUSION AND ADJACENT LEAD IS 0.07.
4. DIMENSION D DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH,
PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED
0.15 mm PER SIDE. DIMENSION D IS DETERMINED AT
DATUM H.
5. DIMENSION E1 DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSIONS. INTERLEAD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.25 mm PER
SIDE. DIMENSION E1 IS DETERMINED AT DATUM H.
6. DATUMS A AND B ARE DETERMINED AT DATUM H.
7. A1 IS DEFINED AS THE VERTICAL DISTANCE FROM
THE SEATING PLANE TO THE LOWEST POINT ON THE
PACKAGE BODY.
8. SECTION B−B TO BE DETERMINED AT 0.10 TO 0.25 mm
FROM THE LEAD TIP.
DIM MIN MAX
MILLIMETERS
A −−−− 1.20
b 0.19 0.30
c 0.09 0.20
A1 0.05 0.15
L 0.45 0.75
M 0 8
__
6.70
14X
0.42
14X
1.15
0.65
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT
E 6.40 BSC
L2 0.25 BSC
RECOMMENDED
3.06
3.40
SECTION B−B
c
c1
b
b1
A2 0.80 1.05
b1 0.19 0.25
c1 0.09 0.16
D 4.90 5.10
D2 3.09 3.62
E1 4.30 4.50
E2 2.69 3.22
0.65 BSCe
SEATING
PLANE
A2
M
L
DETAIL A
END VIEW
PIN 1
7
1
14 8
TOP VIEW
E1
SIDE VIEW
REFERENCE
0.20 C
NOTE 5
2X 14 TIPS
B
0.10 C
C
A
14X
c
DETAIL A
A1
B
B
E2
BOTTOM VIEW
D2
b
0.10
C
NOTE 3
B A
14X
0.05 C
D
NOTE 4
GAUGE
PLANE
C
NOTE 7
H
L2
E
e
BA
NOTE 6
NOTE 8
A
NOTE 6
SS
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NCV47821PAAJR2G

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LDO Voltage Regulators 3.3V TO 20V ADJUSTABLE DU
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