NCV47821
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4
Table 2. MAXIMUM RATINGS
Rating Symbol Min Max Unit
Input Voltage DC V
in
−42 45 V
Input Voltage (Note 1)
Load Dump − Suppressed
U
s*
− 60
V
Enable Input Voltage V
EN1,2
−42 45 V
ADJ Input Voltage V
ADJ1,2
−0.3 10 V
CSO Voltage V
CSO1,2
−0.3 7 V
DE, CS and EF Voltages V
DE
, V
CS
V
EF
−0.3 7 V
Output Voltage V
out1,2
−1 40 V
Junction Temperature T
J
−40 150 °C
Storage Temperature T
STG
−55 150 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Load Dump Test B (with centralized load dump suppression) according to ISO16750−2 standard. Guaranteed by design. Not tested in
production. Passed Class C according to ISO16750−1.
Table 3. ESD CAPABILITY (Note 2)
Rating
Symbol Min Max Unit
ESD Capability, Human Body Model ESD
HBM
−2 2 kV
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (JS−001−2010)
Field Induced Charge Device Model ESD characterization is not performed on plastic molded packages with body sizes < 50 mm2 due
to the inability of a small package body to acquire and retain enough charge to meet the minimum CDM discharge current waveform
characteristic defined in JEDEC JS−002−2014.
Table 4. LEAD SOLDERING TEMPERATURE AND MSL (Note 3)
Rating
Symbol Min Max Unit
Moisture Sensitivity Level MSL 1 −
3. For more information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D
THERMAL CHARACTERISTICS (Note 4)
Rating
Symbol Value Unit
Thermal Characteristics (single layer PCB)
Thermal Resistance, Junction−to−Air (Note 5)
Thermal Reference, Junction−to−Lead (Note 5)
R
θJA
R
ψJL
52
9.0
°C/W
Thermal Characteristics (4 layers PCB)
Thermal Resistance, Junction−to−Air (Note 5)
Thermal Reference, Junction−to−Lead (Note 5)
R
θJA
R
ψJL
31
10
°C/W
4. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
5. Values based on copper area of 645 mm
2
(or 1 in
2
) of 1 oz copper thickness and FR4 PCB substrate. Single layer − according to JEDEC51.3,
4 layers − according to JEDEC51.7
Table 5. RECOMMENDED OPERATING RANGES
Rating Symbol Min Max Unit
Input Voltage (Note 6) V
in
4.4 40 V
Nominal Output Voltages V
out_nom1,2
3.3 20 V
Output Current Limit (Note 7) I
LIM1,2
10 300 mA
Junction Temperature T
J
−40 150 °C
Current Sense Output (CSO) Capacitor C
CSO1,2
1 4.7
mF
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
6. Minimum V
in
= 4.4 V or (V
out1,2
+ 0.5 V), whichever is higher.
7. Corresponding R
CSO1,2
is in range from 25.5 kW down to 850 W.
