T520V686M010ASE060 Datasheet T520D337M006ASE040, T520B107M003ASE070, T520D337M006ASE015 | P4-P6

KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-630036

KEMET

14. High Temperature Life Test

• 105ºC, 0.8 x Rated Voltage, 2000 hours

Post Test Performance:

Capacitance: within -20%

+10% of initial value

b. DF: within initial limit

c. DC Leakage: within 1.25 x initial limit

d. ESR: within 2 x initial limit

15. Storage Life Test

• 105ºC, 0VDC, 2000 Hours

Post Test Perfomance:

Capacitance: within -20%

+10% of initial value

b. DF: within initial limit

c. DC Leakage: within 1.25 x initial limit

d. ESR: within 2 x initial limit

16. Thermal Shock

• Mil-Std-202, Method 107, Condition B

Minimum temperature is -55ºC

Maximum temperature is +105ºC

500 Cycles

Post Test Performance:

a. Capacitance: within +10%/-20% of initial value

b. DF: within initial limit

c. DC Leakage: within initial limit

d. ESR: within 2 x initial limit

17. Moisture Resistance Testing

• J-Std-020

Steps 7a and 7b excluded, 0V, 21 cycles

Post Test Performance:

a. Capacitance: within

±30% of initial value

b. DF: within initial limit

c. DC Leakage: within initial limit

d. ESR: within initial limit

18. Load Humidity

• 85ºC, 85% RH, Rated Voltage, 500 Hours

Post Test Performance:

a. Capacitance: within +35%/-5% of initial value

b. DF: within initial limit

c. DC Leakage: within 5 x initial limit

d. ESR: within 2 x initial limit

19. ESD

• Polymer tantalum capacitors are not sensitive

to Electro-Static Discharge (ESD).

20. Failure Mechanism and Reliability

The normal failure mechanism is dielectric break-

down. Dielectric failure can result in high DC

Leakage current and may proceed to the level of a

short circuit. With sufficient time to charge, heal-

ing may occur by one of two potential mecha-

nisms. The polymer adjacent to the dielectric fault

site may overheat and vaporize, disconnecting the

fault site from the circuit. The polymer may also

Actual power dissipated may be calculated from

the following:

P =I

Substituting I = E, P = E

Z Z

where:

I = rms ripple current (amperes)

E = rms ripple voltage (volts)

P = power (watts)

Z = impedance at specified frequency (ohms)

R = equivalent series resistance at specified

frequency (ohms)

Using P max from Table 3, maximum allowable

rms

ripple current or voltage may be determined as

follows:

I(max) = 公P max

E(max) = Z 公P max

These values should be derated at elevated tem-

peratures as follows:

Temperature Derating Factor

85ºC .9

105ºC .4

ENVIRONMENTAL

12. Temperature Stability

Mounted capacitors withstand extreme tempera-

ture testing at a succession of continuous steps

at +25ºC, -55ºC, +25ºC, +85ºC, +105ºC, +25ºC in

that order. Capacitors are allowed to stabilize at

each temperature before measurement. Cap, DF,

and DCL are measured at each temperature

except DC Leakage is

not measured at -55ºC.

Table 4

Acceptable limits are as follows:

Step Temp. ΔCap DCL DF

1 +25ºC Specified Catalog Catalog

Tolerance Limit Limit

2 -55ºC ±20% of N/A Catalog

initial value Limit

3 +25ºC ±10% of Catalog Catalog

initial value Limit Limit

4 +85ºC ±20% of 10x Catalog 1.2x Catalog

initial value Limit Limit

5 +105ºC ±30% of 10x Catalog 1.5x Catalog

initial value Limit Limit

6 +25ºC ±10% of Catalog Catalog

initial value Limit Limit

13. Standard Life Test

• 85ºC, Rated Voltage, 2000 Hours

Post Test Performance:

Capacitance: within -20%

+10% of initial value

b. DF: within initial limit

c. DC Leakage: within initial limit

d. ESR: within initial limit

COMPONENT PERFORMANCE CHARACTERISTICS

POLYMER TANTALUM CHIP CAPACITORS

KEMET

KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300 37

Polymer Tantalum Surface Mount

KEMET

26. Vibration

• Mil-Std-202, Method 204, Condition D, 10 Hz

to 2,000 Hz, 20G Peak

Post Test Performance:

a. Capacitance — within ±10% of initial value

b. DC Leakage — within initial limit

c. Dissipation Factor — within initial limit

d. ESR — within initial limit

27. Shock

• Mil-Std-202, Method 213, Condition I,

100 G Peak

Post Test Performance:

a. Capacitance — within ±10% of initial value

b. DC Leakage — within initial limit

c. Dissipation Factor — within initial limit

d. ESR - within initial limit

28. Terminal Strength

• Pull Force

• One Pound (454 grams), 30 Seconds

• Tensile Force

• Four Pounds (1.8 kilograms), 60 Seconds

• Shear Force

Table 5 Maximum Shear Loads

Case Code Maximum Shear Loads

KEMET EIA Kilograms Pounds

B 3528-21 3.6 8.0

V 7343-20 5.0 11.0

D 7343-31 5.0 11.0

X 7343-43 5.0 11.0

Post Test Performance:

a. Capacitance — within ±5% of initial value

b. DC Leakage — within initial limit

c. Dissipation Factor — within initial limit

d. ESR - within initial limit

Failure rates may be improved in application by

derating the voltage applied to the capacitor.

KEMET recommends that KO-CAPs be derated

to 80% or less of the rated voltage in application.

KO-CAPs exhibit a benign failure mode in that

they do not fail catastophically even under typical

fault conditions. If a shorted capacitor is allowed

to pass unlimited current, it may overheat and the

case may discolor. But this is distinctly different

from the explosive “ignition” that may occur with

standard MnO2 cathode tantalums. Replacement

of the MnO2 by the polymer removes the oxygen

that fuels ignition during a failure event.

MECHANICAL

21. Resistance to Solvents

• Mil-Std-202, Method 215

Post Test Performance:

a. Capacitance — within ±10% of initial value

b. DC Leakage — within initial limit

c. Dissipation Factor — within initial limit

d. ESR — within initial limit

e. Physical — no degradation of case, terminals

or marking

22. Fungus

• Mil-Std-810, Method 508

23. Flammability

• UL94 VO Classification

Encapsulant materials meet this classifaction

24. Resistance to Soldering Heat

• Maximum Reflow

+240 ±5ºC, 10 seconds

• Typical Reflow

+230 ±5ºC, 30 seconds

Post Test Performance:

a. Capacitance — within ±10% of initial value

b. DC Leakage — within initial limit

c. Dissipation Factor — within initial limit

d. ESR — within initial limit

25. Solderability

• Mil-Std-202, Method 208

• ANSI/J-STD-002, Test B

Applies to Solder Coated terminations only.

COMPONENT PERFORMANCE CHARACTERISTICS

4 lb. (1.8 Kg)

oxidize into a more resistive material that plugs

the defect site in the dielectric and reduces the

flow of current.

Capacitor failure may be induced by exceeding

the rated conditions of forward DC voltage,

reverse DC voltage, surge current, power dissipa-

tion or temperature. Excessive environmental

stress, such as prolonged or high temperature

reflow processes may also trigger dielectric failure

POLYMER TANTALUM CHIP CAPACITORS

KEMET

KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-630038

KEMET

high integrity solder fillets. Preheating of these

components is recommended to avoid extreme

thermal stress. The maximum recommended

preheat rate is 2ºC per second.

Hand-soldering should be avoided. If necessary,

it should be performed with care due to the diffi-

culty in process control. Care should be taken to

avoid contact of the soldering iron to the molded

case. The iron should be used to heat the solder

pad, applying solder between the pad and the

termination, until reflow occurs. The iron should

be removed. “Wiping” the edges of a chip and

heating the top surface is not recommended.

During typical reflow operations a slight darken-

ing of the gold-colored epoxy may be observed.

This slight darkening is normal and is not harmful

to the product. Marking permanency is not affect-

ed by this change.

33. Washing

Standard washing techniques and solvents are

compatible with all KEMET surface mount tanta-

lum capacitors. Solvents such as Freon TMC and

TMS, Trichlorethane, methylene chloride, prelete,

and isopropyl alcohol are not harmful to these

components. Please note that we are not endors-

ing the use of banned or restricted solvents. We

are simply stating that they would not be harmful

to the components.

If ultrasonic agitation is utilized in the cleaning

process, care should be taken to minimize energy

levels and exposure times to avoid damage to the

terminations.

KEMET tantalum chips are also compatible with

newer aqueous and semi-aqueous processes.

34. Encapsulations

Under normal circumstances, potting or encapsu-

lation of KEMET tantalum chips is not required.

35. Storage Environment

Tantalum chip capacitors should be stored in nor-

mal working environments. While the chips them-

selves are quite robust in other environments,

solderability will be degraded by exposure to high

temperatures, high humidity, corrosive atmos-

pheres, and long term storage. In addition, pack-

aging materials will be degraded by high temper-

ature - reels may soften or warp, and tape peel

force may increase. KEMET recommends that

maximum storage temperature not exceed 40

degrees C, and the maximum storage humidity

not exceed 60% relative humidity. In addition,

temperature fluctuations should be minimized to

avoid condensation on the parts, and atmos-

pheres should be free of chlorine and sulfur bear-

ing compounds. For optimized solderability, chip

stock should be used promptly, preferably within

1.5 years of receipt.

30. Termination Coating

The standard finish coating is 90/10 Sn/Pb solder

(Tin/Lead-solder coated). 100% tin coating is

available upon request.

31. Recommended Mounting Pad Geometries

Proper mounting pad geometries are essential for

successful solder connections. These dimensions

are highly process sensitive and should be

designed to maximize the intergrity of the solder

joint, and to minimize component rework due to

unacceptable solder joints.

Figure 5 illustrates pad geometry. The table pro-

vides recommended pad dimensions for reflow

soldering techniques. These dimensions are

intended to be a starting point for circuit board

designers, to be fine tuned, if necessary, based

upon the peculiarities of the soldering process

and/or circuit board design.

Contact KEMET for Engineering Bulletin Number

F-2100 entitled “Surface Mount Mounting Pad

Dimensions and Considerations” for further

details on this subject.

Table 6 - Land Pattern Dimensions for Reflow Solder

Pad Dimensions

Z G X (ref) (ref)

B/3528-21

5.00 1.10 2.50 1.95 3.05

D/7343-31, V/7343-20, X/7343-43

8.90 3.80 2.70 2.55 6.35

32. Soldering

The T520 KO-CAP family has been designed for

reflow solder processes. They are not recom-

mended for wave solder. Solder-coated termina-

tions have excellent wetting characteristics for

COMPONENT PERFORMANCE CHARACTERISTICS

Figure 5

KEMET/EIA Size Code

APPLICATIONS

29. Handling

Automatic handling of encapsulated components

is enhanced by the molded case which provides

compatibility with all types of high speed pick and

place equipment. Manual handling of these

devices presents no unique problems. Care

should be taken with your fingers, however, to

avoid touching the solder-coated terminations as

body oils, acids and salts will degrade the sol-

derability of these terminations. Finger cots

should be used whenever manually handling all

solderable surfaces.

Grid

Placement

Courtyard

KEMET

POLYMER TANTALUM CHIP CAPACITORS

P1-P3 P4-P6 P7-P9

T520V686M010ASE060

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