SUD50N10-18P-GE3

Vishay Siliconix
SUD50N10-18P-GE3
Document Number: 65717
S12-1958-Rev. C, 13-Aug-12
www.vishay.com
1
Document Number: 65717
S12-1958-Rev. C, 13-Aug-12
www.vishay.com
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
For technical questions, contact: pmostechsupport@vishay.com
N-Channel 100 V (D-S), 150 °C MOSFET
FEATURES
TrenchFET
®
Power MOSFET
100 % R
g
and UIS Tested
Material categorization:
For definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
Primary Side Switch
Isolated DC/DC Converter
Notes:
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
PRODUCT SUMMARY
V
DS
(V) R
DS(on)
()I
D
(A)
a
Q
g
(Typ.)
100 0.0185 at V
GS
= 10 V 50 48 nC
SGD
Top View
Drain Connected to Tab
Ordering Information:
SUD50N10-18P-GE3 (Lead (Pb)-free and Halogen-free)
TO-252
N-Channel MOSFET
G
D
S
ABSOLUTE MAXIMUM RATINGS T
A
= 25 °C, unless otherwise noted
Parameter Symbol Limit Unit
Drain-Source Voltage
V
DS
100
V
Gate-Source Voltage
V
GS
± 20
Continuous Drain Current (T
J
= 150 °C)
T
C
= 25 °C
I
D
50
a
A
T
C
= 100 °C
33.4
T
A
= 25 °C
7.8
b
T
A
= 100 °C
5
b
Pulsed Drain Current
I
DM
100
Continuous Source-Drain Diode Current
T
C
= 25 °C
I
S
50
a
T
A
= 25 °C
1.7
b
Single Pulse Avalanche Current
L = 0.1 mH
I
AS
45
Avalanche Energy
E
AS
101
mJ
Maximum Power Dissipation
T
C
= 25 °C
P
D
113.6
W
T
C
= 100 °C
45.5
T
A
= 25 °C
2.5
b
T
A
= 100 °C
1
b
Operating Junction and Storage Temperature Range
T
J
, T
stg
- 55 to 150
°C
THERMAL RESISTANCE RATINGS
Parameter Symbol Typical Maximum Unit
Maximum Junction-to-Ambient
b
Steady State
R
thJA
40 50
°C/W
Maximum Junction-to-Case R
thJC
0.85 1.1
Vishay Siliconix
SUD50N10-18P-GE3
Document Number: 65717
S12-1958-Rev. C, 13-Aug-12
www.vishay.com
2
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
For technical questions, contact: pmostechsupport@vishay.com
Notes:
a. Pulse test; pulse width 300 µs, duty cycle 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
SPECIFICATIONS (T
J
= 25 °C, unless otherwise noted)
Parameter Symbol Test Conditions Min. Typ. Max. Unit
Static
Drain-Source Breakdown Voltage V
DS
V
GS
= 0 V, I
D
= 250 µA 100 V
V
DS
Temperature Coefficient V
DS
/T
J
I
D
= 250 µA
110
mV/°C
V
GS(th)
Temperature Coefficient V
GS(th)
/T
J
- 12.5
Gate-Source Threshold Voltage V
GS(th)
V
DS
= V
GS
, I
D
= 250 µA 2.5 5 V
Gate-Source Leakage I
GSS
V
DS
= 0 V, V
GS
= ± 20 V ± 100 nA
Zero Gate Voltage Drain Current I
DSS
V
DS
= 100 V, V
GS
= 0 V 1
µA
V
DS
= 100 V, V
GS
= 0 V, T
J
= 125 °C 50
On-State Drain Current
a
I
D(on)
V
DS
5 V, V
GS
= 10 V 50 A
Drain-Source On-State Resistance
a
R
DS(on)
V
GS
= 10 V, I
D
= 15 A 0.0150 0.0185
Forward Transconductance
a
g
fs
V
DS
= 15 V, I
D
= 15 A 33 S
Dynamic
b
Input Capacitance C
iss
V
DS
= 50 V, V
GS
= 0 V, f = 1 MHz
2600
pFOutput Capacitance C
oss
230
Reverse Transfer Capacitance C
rss
80
Total Gate Charge Q
g
V
DS
= 50 V, V
GS
= 10 V, I
D
= 50 A
48 75
nCGate-Source Charge Q
gs
16
Gate-Drain Charge Q
gd
13
Gate Resistance R
g
f = 1 MHz 1.6 2.5
Tur n - O n D e l ay Time t
d(on)
V
DD
= 50 V, R
L
= 1
I
D
50 A, V
GEN
= 10 V, R
g
= 1
12 20
ns
Rise Time t
r
10 20
Turn-Off Delay Time t
d(off)
18 35
Fall Time t
f
815
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode
I
S
T
C
= 25 °C 50
A
Pulse Diode Forward Current
a
I
SM
100
Body Diode Voltage V
SD
I
S
= 15 A 0.85 1.5 V
Body Diode Reverse Recovery Time t
rr
I
F
= 50 A, dI/dt = 100 A/µs, T
J
= 25 °C
80 120 ns
Body Diode Reverse Recovery Charge Q
rr
160 240 nC
Reverse Recovery Fall Time t
a
57
ns
Reverse Recovery Rise Time t
b
23
Vishay Siliconix
SUD50N10-18P-GE3
Document Number: 65717
S12-1958-Rev. C, 13-Aug-12
www.vishay.com
3
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
For technical questions, contact: pmostechsupport@vishay.com
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
Output Characteristics
Transconductance
On-Resistance vs. Gate-to-Source Voltage
0
20
40
60
80
100
012345
V
DS
- Drain-to-Source Voltage (V)
- Drain Current (A)I
D
V
GS
=10V thru8V
V
GS
=6V
V
GS
=7V
0
15
30
45
60
75
0 1020304050
I
D
- Drain Current (A)
- Transconductance (S)
g
fs
T
C
= 25 °C
T
C
= 125 °C
T
C
= - 55 °C
0.00
0.02
0.04
0.06
0.08
0.10
45678 910
- On-Resistance (Ω)R
DS(on)
V
GS
- Gate-to-Source Voltage (V)
T
A
= 25 °C
T
A
= 150 °C
I
D
=15A
Transfer Characteristics
On-Resistance vs. Drain Current
Capacitance
0.0
0.4
0.8
1.2
1.6
2.0
02468 10
V
GS
- Gate-to-Source Voltage (V)
- Drain Current (A)I
D
T
C
= 125 °C
T
C
= - 55 °C
T
C
= 25 °C
0.000
0.009
0.018
0.027
0.036
0 20406080 100
- On-Resistance (Ω)
R
DS(on)
I
D
- Drain Current (A)
V
GS
=10V
C
rss
0
700
1400
2100
2800
3500
020406080 100
C
oss
C
iss
V
DS
- Drain-to-Source Voltage (V)
C - Capacitance (pF)

SUD50N10-18P-GE3

Mfr. #:
Manufacturer:
Vishay / Siliconix
Description:
MOSFET RECOMMENDED ALT 781-SUD35N10-26P-E3
Lifecycle:
New from this manufacturer.
Delivery:
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Payment:
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