SpecNo.JELF243A-0039Q-01 P3/8
MURATA MFG.CO., LTD
Reference Only
8.Environmental Performance (It shall be soldered on the substrate.)
No. Item Specification Test Method
8.1 Heat Resistance Appearance:No damage
Inductance Change: within ± 5%
DC Resistance Change:
within ± 5%
Temperature: 85±2°C
Time: 1000± hours
Then measured after exposure in the room condition
for 24±2 hours.
8.2 Cold Resistance Temperature: -40±2°C
Time: 1000± hours
Then measured after exposure in the room condition
for 24±2 hours.
8.3 Humidity Temperature: 40±2°C
Humidity: 90~95%(RH)
Time: 1000± hours
Then measured after exposure in the room condition
for 24±2 hours.
8.4 Temperature
Cycle
1 cycle:
1 step: -40±2°C / 30±3 minutes
2 step: Ordinary temp. / 10 to 15 minutes
3 step: +85±2°C / 30±3 min
4 step: Ordinary temp. / 10 to 15 minutes
Total of 10 cycles
Then measured after exposure in the room condition
for 24±2 hours.
9. Specification of Packaging
9.1 Appearance and Dimensions of plastic tape
(in mm)
9.2 Specification of Taping
(1) Packing quantity (standard quantity)
2,000 pcs / reel
(2) Packing Method
Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Plastic tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater,
and are not continuous. The specified quantity per reel is kept.
9.3 Pull Strength
Embossed carrier tape 10N min.
Cover tape 5N min.
9.4 Peeling off force of cover tape
Speed of Peeling off 300mm/min
Peeling off force
0.2 to 0.7N
(minimum value is typical)
165 to 180 degree
F
Cover tape
Plastic tape
2.9±0.2
2.0±0.05
4.0±0.1
Direction of feed
2.1±0.1
※
Lead- in/out wire
4.0±0.1
3.6±0.2
8.0±0.2
1.75±0.13.5±0.05
φ
1.5
-0
+0.1
0.2
※
The packing directions of the chip coil
in taping are unified with the in/out
positions of the lead wire.
( )
48
0
48
0
48
0
