LQH32CN220K23L

SpecNo.JELF243A-0039Q-01 P4/8
MURATA MFG.CO., LTD
Reference Only
9.5 Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (cover tape) and trailer-tape (empty tape) as follows.
9.6 Marking for reel
Customer part number, MURATA part number, Inspection number(*1), RoHS marking(*2), Quantity etc ・・・
*1) <Expression of Inspection No.> □□ OOOO ×××
(1) (2) (3)
(1) Factory Code
(2) Date First digit : Year / Last digit of year
Second digit : Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
Third, Fourth digit : Day
(3) Serial No.
*2) « Expression of RoHS marking » ROHS – Y
()
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
9.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS marking (*2) ,Quantity, etc ・・・
9.8. Specification of Outer Case
Outer Case Dimensions
(mm)
Standard Reel Quantity in Outer Case
(Reel)
W D H
186 186 93 5
*Above Outer Case size is typical. It depends on a quantity of an order.
10. Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability
for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment (7) Traffic signal equipment
(2) Aerospace equipment
(8) Disaster prevention / crime prevention equipment
(3) Undersea equipment
(9) Data-processing equipment
(4) Power plant control equipment (10) Applications of similar complexity and /or reliability requirements
(5) Medical equipment
to the applications listed in the above
(6) Transportation equipment (vehicles, trains, ships, etc.)
W
D
Label
H
Empty tape
190 min.
Leader
Trailer
Cover tape
2.0±0.5
φ
13.0±0.2
φ
21.0±0.8
φ
180±
φ
60±
13±1.4
1
0
0
3
Direction of feed
210 min.
160 min.
1
0
Label
SpecNo.JELF243A-0039Q-01 P5/8
MURATA MFG.CO., LTD
Reference Only
11. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
11.1 Land pattern designing
Recommended land patterns for flow and reflow soldering are as follows:
These have been designed for Electric characteristics and solderability.
Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or
solderability may be affected, or result to "position shift" in soldering process.
Flow Soldering Reflow Soldering *
(in mm)
* Applicable to flow soldering.
11.2 Flux, Solder
Flux
Use rosin-based flux.
Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).
Don’t use water-soluble flux.
Solder
Use Sn-3.0Ag-0.5Cu solder
Standard thickness of solder paste : 200μm to 300μm
Other flux (except above) Please contact us for details, then use.
11.3 Flow soldering conditions / Reflow soldering conditions
Pre-heating should be in such a way that the temperature difference between solder and product surface is limited
to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is
limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of
product quality.
Soldering profile
(1)Flow soldering profile
Standard Profile Limit Profile
Pre-heating 15060s min.
Heating 2504s6s 265 ±3℃℃5s
Cycle of flow 2 times 1 time
Chip Coil
Solder Resist
Land
5.5
1.3
1.0
5.5
1.0
2.0
1.0 1.3 1.0
265±3
Heating Time
150
Limit Profile
Standard Profile
(s)Time.
Temp.
(℃)
60s min.
250
SpecNo.JELF243A-0039Q-01 P6/8
MURATA MFG.CO., LTD
Reference Only
(2)Reflow soldering profile
Standard Profile Limit Profile
Pre-heating
150180°C 90s±30s
Heating above 220°C30s60s above 230°C60s max.
Peak temperature 245±3°C 260°C,10s
Cycle of reflow 2 times 1 time
11.4 Reworking with soldering iron.
The following conditions must be strictly followed when using a soldering iron.
Pre-heating 150°C,1 min
Tip temperature 350°C max.
Soldering iron output 80W max.
Tip diameter φ3mm max.
Soldering time 3(+1,-0)s
Times 2 times
Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the
crack on the products due to the thermal shock.
11.5 Solder Volume
Solder shall be used not to be exceeded the upper limits as shown below.
Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
1/3T t T
(T: Lower flange thickness)
Upper Limit
Recommendable
T
t
Limit Profile
Standard Profile
90s±30s
230
260
245±3
220
30s~60s
60s max.
180
150
Temp.
(s)
(℃)
Time.

LQH32CN220K23L

Mfr. #:
Manufacturer:
Murata Electronics
Description:
Fixed Inductors 22uH 10%
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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