7© 2012 Semtech Corporation
www.semtech.com
PROTECTION PRODUCTS
uClamp5612T
Applications Information
Assembly Guidelines
The small size of this device means that some care
must be taken during the mounting process to insure
reliable solder joint. The table below provides
Semtech's recommended assembly guidelines for
mounting this device. The figure at the right details
Semtech’s recommended aperture based on the
below recommendations. Note that these are only
recommendations and should serve only as a starting
point for design since there are many factors that
affect the assembly process. The exact manufactur-
ing parameters will require some experimentation to
get the desired solder application.
retemaraPylbmessAnoitadnemmoceR
ngiseDlicnetSredloSdehsilop-ortcelE,tucresaL
epahserutrepAralugnatceR
ssenk
cihTlicnetSredloS)"400.0(mm001.0
epyTetsaPredloSrellamsroerehpsezis4epyT
eliforPwolfeRredloS020-DTS-JCEDEJ
reP
ngiseDdaPredloSBCPdenifedksamredloS-noN
hsiniFdaPBCPuAiNROPSO
Recommended Mounting Pattern
Stencil Opening
Land Pad ( Follow drawing )
All Dimensions are in mm.
Land Pad.
Stencil opening Component
.80
1.50
.43
.20
.53
.20
.15
