Information relating to products and services furnished herein by Microsemi Corporation or its subsidiaries (collectively “Microsemi”) is
believed to be reliable. However, Microsemi assumes no liability for errors that may appear in this publication, or for liability otherwise
arising from the application or use of any such information, product or service or for any infringement of patents or other intellectual
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This publication is issued to provide information only and (unless agreed by Microsemi in writing) may not be used, applied or
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services concerned. The products, their specifications, services and other information appearing in this publication are subject to
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suitability of any product or service. Information concerning possible methods of use is provided as a guide only and does not
constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user’s responsibility to
fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used
is up to date and has not been superseded. Manufacturing does not necessarily include testing of all functions or parameters. These
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TECHNICAL DOCUMENTATION – NOT FOR RESALE
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Microsemi Corporation (NASDAQ: MSCC) offers a comprehensive portfolio of semiconductor
solutions for: aerospace, defense and security; enterprise and communications; and industrial
and alternative energy markets. Products include mixed-signal ICs, SoCs, and ASICs;
programmable logic solutions; power management products; timing and voice processing
devices; RF solutions; discrete components; and systems. Microsemi is headquartered in Aliso
Viejo, Calif. Learn more at www.microsemi.com.
Microsemi Corporate Headquarters
One Enterprise, Aliso Viejo CA 92656 USA
Within the USA: +1 (949) 380-6100
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