RR00-1097
Specification for
Chip resistor RR1220 series
0
10/14
Test board
Test board A
(
For substrate banding, adhesion test,
see Fig.4
)
Material: Glass fabric base epoxy resin 1.6mm
Copper foil, thickness 0.035 mm
Solder resist coating
Test board B
(
For another test, see Fig.5
)
Material: Glass fabric base epoxy resin 1.6mm
Copper foil, thickness 0.035 mm
Solder resist coating
Mounting method
(
1
)
Mounting method according to solder bath method
Epoxy based adhesive agent shall be applied in the middle between the lands of the test board and the
resistor shall be mounted in such a way that resistor's electrodes will be evenly placed in the land area
and then the adhesive agent shall be hardened. Then a methanol medium of 25% colophony by specific
weight is used as flux
(
if non-deviant test results are assurable over the counter colophony based flux
may be used
)
and is soldered by dipping in a molten solder bath of 260
±
5 deg C and immersed for 3 to
5 s.
(
2
)
Mounting method according to reflow soldering method
About 200
μ
m of solder cream is applied in the land portion of the test boards and the resistor shall be
mounted in such a way so that the resistor's electrodes will be evenly placed on the land. It is soldered
under the conditions of board surface temperature 240 to 250deg C
(
peak temperature
)
for 5 to 10 s. in
an upper-portion heated oven.
