RR00-1097
Specification for
Chip resistor RR1220 series
SUSUM
U
CO.,LTD
TITLE:
SPEC.NO:
0
Rev. No.
7/14
6.2.3 Resistance to soldering heat
Method;
(1) Solder bath method
Preheat 100
110deg C
30 s.
Temperature 270
±
5deg C 10
±
1 s.
(2) Reflow soldering method
Peak temperature 260
±
5deg C 10 sec. or less
Temperature 220deg C over 60 s. max.
The heating apparatus shall be the upper-heated oven and the temperature shall be board surface
temperature.
(3) Soldering iron method
Bit temperature 350
±
5deg C
Time 3 +1
0 s.
The resistor shall be stored at standard atmospheric conditions for 1 hr after which the measurements shall
be made.
For other procedures, refer to IEC 60115-1, Sub-clause 4.18.
Specification:
Change in resistance :
±
(0.5%+0.05
Ω
)
Without mechanical damage.
Electrical characteristics shall be satisfied.
6.2.4 Solderability
Method;
Temperature of solder 235
±
5deg C
(Solder alloy: Sn-37Pb)
245
±
5deg C (Solder alloy: Sn-3Ag-0.5Cu)
Duration of immersion 2
±
0.5 s.
For other procedures, refer to IEC 60115-1, Sub-clause 4.17.
Specification:
A new uniform coating of solder shall cover minimum of 95% of the surface being immersed.
6.2.5 Solvent resistance
Method;
Immersion cleaning
At normal temperature : 300 sec. Using Isopropyl alcohol.
For other procedures, refer to IEC 60115-1, Sub-clause 4.29.
Specification:
Marking shall be legible.
Without mechanical damage and distinct damage in appearance.
RR00-1097
Specification for
Chip resistor RR1220 series
SUSUM
U
CO.,LTD
TITLE:
SPEC.NO:
0
Rev. No.
8/14
6.3 Endurance
6.3.1 Rapid change of temperature
Method;
The resistor shall be subjected to 5 continuous cycles, each as shown in the figure below.
Minimum operating temperature
±3
deg C 30 min
Standard atmospheric conditions 2
3 min
Maximum operating temperature
±2
deg C 30 min
Standard atmospheric conditions 2
3 min
For other procedures, refer to IEC 60115-1, Sub-clause 4.19.
Specification;
Change in resistance :
±(
0.5%+0.05
Ω)
Without mechanical damage such as breaks and distinct damage in appearance.
Marking shall be legible.
6.3.2 Endurance
(
Damp heat with load
)
Method;
The specimen shall be placed in the test chamber at a temperature 40
±
2deg C and a relative humidity
90 to 95 %, and then subjected to a voltage cycle consisting of rated d.c. voltage application of 1 hr 30
min and rest of 30 min repeatedly for 1000 +48/0 hrs.
However the applied voltage shall not exceed the limited element voltage.
For other procedures, refer to IEC 60115-1, Sub-clause 4.24.
Specification;
Change in resistance :
±(
0.5%+0.05
Ω)
Without mechanical damage such as breaks and distinct damage in appearance.
Marking shall be legible.
6.3.3 Endurance
(
rated load
)
Method;
The specimen shall be placed in the test chamber at 70
±
2deg C, and then subjected to a voltage cycle
consisting of rated d.c. voltage application of 1 hr 30 min and rest of 30 min repeatedly for 1000 +48/0
hrs.
However the applied voltage shall not exceed the limited element voltage.
For other procedures, refer to IEC 60115-1, Sub-clause 4.25.
Specification;
Change in resistance :
±(
0.5%+0.05
Ω)
Without mechanical damage such as breaks and distinct damage in appearance.
Marking shall be legible.

RR1220P-222-B-T5

Mfr. #:
Manufacturer:
Susumu
Description:
RES SMD 2.2K OHM 0.1% 1/10W 0805
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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