© 2007 Microchip Technology Inc. DS21293C-page 13
MCP3001
3.0 PIN DESCRIPTIONS
3.1 IN+
Positive analog input. This input can vary from IN- to
V
REF
+ IN-.
3.2 IN-
Negative analog input. This input can vary ±100 mV
from V
SS
.
3.3 CS/SHDN(Chip Select/Shutdown)
The CS/SHDN pin is used to initiate communication
with the device when pulled low and will end a conver-
sion and put the device in low power standby when
pulled high. The CS
/SHDN pin must be pulled high
between conversions.
3.4 CLK (Serial Clock)
The SPI clock pin is used to initiate a conversion and to
clock out each bit of the conversion as it takes place.
See Section 6.2 for constraints on clock speed.
3.5 DOUT (Serial Data output)
The SPI serial data output pin is used to shift out the
results of the A/D conversion. Data will always change
on the falling edge of each clock as the conversion
takes place.
4.0 DEVICE OPERATION
The MCP3001 A/D converter employs a conventional
SAR architecture. With this architecture, a sample is
acquired on an internal sample/hold capacitor for
1.5 clock cycles starting on the first rising edge of the
serial clock after CS has been pulled low. Following this
sample time, the input switch of the converter opens
and the device uses the collected charge on the inter-
nal sample and hold capacitor to produce a serial 10-bit
digital output code. Conversion rates of 200 ksps are
possible on the MCP3001. See Section 6.2 for informa-
tion on minimum clock rates. Communication with the
device is done using a 3-wire SPI-compatible interface.
4.1 Analog Inputs
The MCP3001 provides a single pseudo-differential
input. The IN+ input can range from IN- to (V
REF
+IN-).
The IN- input is limited to ±100 mV from the V
SS
rail.
The IN- input can be used to cancel small signal com-
mon-mode noise which is present on both the IN+ and
IN- inputs.
For the A/D Converter to meet specification, the charge
holding capacitor, C
SAMPLE
must be given enough time
to acquire a 10-bit accurate voltage level during the
1.5 clock cycle sampling period. The analog input
model is shown in Figure 4-1.
In this diagram, it is shown that the source impedance
(R
S
) adds to the internal sampling switch, (R
SS
) imped-
ance, directly affecting the time that is required to
charge the capacitor, C
SAMPLE
. Consequently, a larger
source impedance increases the offset, gain, and inte-
gral linearity errors of the conversion.
Ideally, the impedance of the signal source should be
near zero. This is achievable with an operational ampli-
fier such as the MCP601, which has a closed loop out-
put impedance of tens of ohms. The adverse affects of
higher source impedances are shown in Figure 4-2.
If the voltage level of IN+ is equal to or less than IN-, the
resultant code will be 000h. If the voltage at IN+ is equal
to or greater than {[V
REF
+ (IN-)] - 1 LSB}, then the out-
put code will be 3FFh. If the voltage level at IN- is more
than 1 LSB below V
SS
, then the voltage level at the IN+
input will have to go below V
SS
to see the 000h output
code. Conversely, if IN- is more than 1 LSB above Vss,
then the 3FFh code will not be seen unless the IN+
input level goes above V
REF
level.
4.2 Reference Input
The reference input (V
REF
) determines the analog input
voltage range and the LSB size, as shown below.
As the reference input is reduced, the LSB size is
reduced accordingly. The theoretical digital output code
produced by the A/D Converter is a function of the ana-
log input signal and the reference input as shown
below.
where:
V
IN
= analog input voltage = V(IN+) - V(IN-)
V
REF
= reference voltage
When using an external voltage reference device, the
system designer should always refer to the manufac-
turer’s recommendations for circuit layout. Any instabil-
ity in the operation of the reference device will have a
direct effect on the operation of the ADC.
LSB Size
V
REF
1024
-------------=
Digital Output Code
1024*V
IN
V
REF
------------------------=
MCP3001
DS21293C-page 14 © 2007 Microchip Technology Inc.
FIGURE 4-1: Analog Input Model.
FIGURE 4-2: Maximum Clock Frequency vs. Input
Resistance (R
S
) to maintain less than a 0.1LSB
deviation in INL from nominal conditions.
C
PIN
VA
R
SS
CHx
7pF
V
T
= 0.6V
V
T
= 0.6V
I
LEAKAGE
Sampling
Switch
SS
R
S
= 1 kΩ
C
SAMPLE
= DAC capacitance
V
SS
V
DD
= 20 pF
±1 nA
Legend
VA = signal source
R
SS
= source impedance
CHx = input channel pad
C
PIN
= input pin capacitance
V
T
= threshold voltage
I
LEAKAGE
= leakage current at the pin
due to various junctions
SS = sampling switch
R
S
= sampling switch resistor
C
SAMPLE
= sample/hold capacitance
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
100 1000 10000
Input Resistance (Ohms)
Clock Frequency (MHz)
V
DD
= V
REF
= 5V
f
SAMPLE
= 200 ksps
V
DD
= V
REF
= 2.7V
f
SAMPLE
= 75 ksps
© 2007 Microchip Technology Inc. DS21293C-page 15
MCP3001
5.0 SERIAL COMMUNICATIONS
Communication with the device is done using a stan-
dard SPI compatible serial interface. Initiating commu-
nication with the MCP3001 begins with the CS going
low. If the device was powered up with the CS
pin low,
it must be brought high and back low to initiate commu-
nication. The device will begin to sample the analog
input on the first rising edge after CS
goes low. The
sample period will end in the falling edge of the second
clock, at which time the device will output a low null bit.
The next 10 clocks will output the result of the conver-
sion with MSB first, as shown in Figure 5-1. Data is
always output from the device on the falling edge of the
clock. If all 10 data bits have been transmitted and the
device continues to receive clocks while the CS
is held
low, the device will output the conversion result LSB
first, as shown in Figure 5-2. If more clocks are pro-
vided to the device while CS
is still low (after the LSB
first data has been transmitted), the device will clock
out zeros indefinitely.
If it is desired, the CS
can be raised to end the conver-
sion period at any time during the transmission. Faster
conversion rates can be obtained by using this tech-
nique if not all the bits are captured before starting a
new cycle. Some system designers use this method by
capturing only the highest order 8 bits and ‘throwing
away’ the lower 2 bits.
FIGURE 5-1: Communication with MCP3001 (MSB first Format).
FIGURE 5-2: Communication with MCP3001 (LSB first Format).
CS
CLK
D
OUT
t
CYC
Power
Down
t
SUCS
t
SAMPLE
t
CONV
t
DATA
**
* After completing the data transfer, if further clocks are applied with CS
low, the ADC will output LSB first data,
followed by zeros indefinitely. See Figure below.
** t
DATA
: during this time, the bias current and the comparator powers down and the reference input becomes a
high impedance node.
t
CSH
B9 B8 B7 B6 B5 B4 B3 B2 B1 B0*
HI-Z
HI-Z
NULL
BIT
B9 B8 B7 B6
NULL
BIT
CS
CLK
D
OUT
t
CYC
Power Down
t
SUCS
t
SAMPLE
t
CONV
t
DATA
**
* After completing the data transfer, if further clocks are applied with CS
low, the ADC will output zeros indefi-
nitely.
** t
DATA
: during this time, the bias current and the comparator powers down and the reference input becomes a
high impedance node leaving the CLK running to clock out the LSB-first data or zeros.
t
CSH
NULL
BIT
B9 B8 B7 B6 B5 B4 B3 B2 B1 B0
HI-Z
B1 B2 B3
B4
B5 B6 B7 B8 B9
HI-Z

MCP3001-I/ST

Mfr. #:
Manufacturer:
Microchip Technology
Description:
Analog to Digital Converters - ADC 10-bit SPI Sgl Chl IND TEMP, TSSOP8
Lifecycle:
New from this manufacturer.
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