MCP3001
DS21293C-page 16 © 2007 Microchip Technology Inc.
6.0 APPLICATIONS INFORMATION
6.1 Using the MCP3001 with
Microcontroller SPI Ports
With most microcontroller SPI ports, it is required to
clock out eight bits at a time. If this is the case, it will be
necessary to provide more clocks than are required for
the MCP3001. As an example, Figure 6-1 and
Figure 6-2 show how the MCP3001 can be interfaced
to a microcontroller with a standard SPI port. Since the
MCP3001 always clocks data out on the falling edge of
clock, the MCU SPI port must be configured to match
this operation. SPI Mode 0,0 (clock idles low) and SPI
Mode 1,1 (clock idles high) are both compatible with
the MCP3001. Figure 6-1 depicts the operation shown
in SPI Mode 0,0, which requires that the CLK from the
microcontroller idles in the ‘low’ state. As shown in the
diagram, the MSB is clocked out of the ADC on the fall-
ing edge of the third clock pulse. After the first eight
clocks have been sent to the device, the microcontrol-
ler’s receive buffer will contain two unknown bits (the
output is at high impedance for the first two clocks), the
null bit and the highest order five bits of the conversion.
After the second eight clocks have been sent to the
device, the MCU receive register will contain the lowest
order five bits and the B1-B4 bits repeated as the ADC
has begun to shift out LSB first data with the extra
clocks. Typical procedure would then call for the lower
order byte of data to be shifted right by three bits to
remove the extra B1-B4 bits. The B9-B5 bits are then
rotated 3 bits to the right with B7-B5 rotating from the
high order byte to the lower order byte. Easier manipu-
lation of the converted data can be obtained by using
this method.
Figure 6-2 shows SPI Mode 1,1 communication which
requires that the clock idles in the high state. As with
mode 0,0, the ADC outputs data on the falling edge of
the clock and the MCU latches data from the ADC in on
the rising edge of the clock.
FIGURE 6-1: SPI Communication with the MCP3001 using 8-bit segments (Mode 0,0: SCLK idles low).
FIGURE 6-2: SPI Communication with the MCP3001 using 8-bit segments (Mode 1,1: SCLK idles high).
CS
CLK 910111213141516
D
OUT
NULL
BIT
B9 B8 B7 B6
B5
B4 B3 B2 B1 B0 B1 B2
HI-Z
B5 B4 B3 B2 B1 B0 B1 B2B9 B8 B7 B6??0
MCU latches data from ADC
Data is clocked out of
ADC on falling edges
on rising edges of SCLK
12345678
HI-Z
B3
B3
LSB first data begins
to come out
B4
Data stored into MCU receive register
after transmission of first 8 bits
Data stored into MCU receive register
after transmission of second 8 bits
CS
CLK
910111213141516
D
OUT
NULL
BIT
B9 B8 B7 B6
B5
B4 B3 B2 B1 B0 B1 B2
HI-Z
B5
B4 B3 B2 B1 B0 B1 B2
B9 B8 B7 B6??0
MCU latches data from ADC
Data is clocked out of
ADC on falling edges
on rising edges of SCLK
1234567
8
B3
B3
LSB first data begins
to come out
HI-Z
Data stored into MCU receive register
after transmission of first 8 bits
Data stored into MCU receive register
after transmission of second 8 bits
© 2007 Microchip Technology Inc. DS21293C-page 17
MCP3001
6.2 Maintaining Minimum Clock Speed
When the MCP3001 initiates the sample period, charge
is stored on the sample capacitor. When the sample
period is complete, the device converts one bit for each
clock that is received. It is important for the user to note
that a slow clock rate will allow charge to bleed off the
sample cap while the conversion is taking place. At
85°C (worst case condition), the part will maintain
proper charge on the sample cap for 700 µs at
V
DD
= 2.7V and 1.5 ms at V
DD
= 5V. This means that at
V
DD
= 2.7V, the time it takes to transmit the first 14
clocks must not exceed 700 µs. Failure to meet this cri-
terion may induce linearity errors into the conversion
outside the rated specifications.
6.3 Buffering/Filtering the Analog Inputs
If the signal source for the ADC is not a low impedance
source, it will have to be buffered or inaccurate conver-
sion results may occur. See Figure 4-2. It is also rec-
ommended that a filter be used to eliminate any signals
that may be aliased back into the conversion results.
This is illustrated in Figure 6-3 where an op amp is
used to drive, filter and gain the analog input of the
MCP3001. This amplifier provides a low impedance
source for the converter input and a low pass filter,
which eliminates unwanted high frequency noise.
Low pass (anti-aliasing) filters can be designed using
Microchip’s interactive FilterLab software. FilterLab
will calculate capacitor and resistor values, as well as
determine the number of poles that are required for the
application. For more information on filtering signals,
see the application note AN699 “Anti-Aliasing Analog
Filters for Data Acquisition Systems.”
FIGURE 6-3: The MCP601 operational amplifier is
used to implement a 2nd order anti-aliasing filter for
the signal being converted by the MCP3001.
6.4 Layout Considerations
When laying out a printed circuit board for use with
analog components, care should be taken to reduce
noise wherever possible. A bypass capacitor should
always be used with this device and should be placed
as close as possible to the device pin. A bypass capac-
itor value of 1 µF is recommended.
Digital and analog traces should be separated as much
as possible on the board and no traces should run
underneath the device or the bypass capacitor. Extra
precautions should be taken to keep traces with high
frequency signals (such as clock lines) as far as possi-
ble from analog traces.
Use of an analog ground plane is recommended in
order to keep the ground potential the same for all
devices on the board. Providing V
DD
connections to
devices in a “star” configuration can also reduce noise
by eliminating current return paths and associated
errors. See Figure 6-4. For more information on layout
tips when using ADC, refer to AN-688 “Layout Tips for
12-Bit A/D Converter Applications”.
FIGURE 6-4: V
DD
traces arranged in a ‘Star’
configuration in order to reduce errors caused by
current return paths.
MCP3001
V
DD
10 µF
IN-
IN+
-
+
V
IN
C
1
C
2
V
REF
4.096V
Reference
F
10 µF
0.1 µF
MCP601
R
1
R
2
R
3
R
4
MCP1541
C
L
V
DD
Connection
Device 1
Device 2
Device 3
Device 4
MCP3001
DS21293C-page 18 © 2007 Microchip Technology Inc.
7.0 PACKAGING INFORMATION
7.1 Package Marking Information
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
* This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it wi
ll
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
XXXXXXXX
XXXXXNNN
YYWW
8-Lead PDIP (300 mil)
Example:
8-Lead SOIC (150 mil)
Example:
XXXXXXXX
XXXXYYWW
NNN
8-Lead TSSOP
Example:
MCP3001
I/PNNN
0736
MCP3001
NNN
8-Lead MSOP
Example:
XXXX
YYWW
NNN
XXXXXX
YWWNNN
3001
0716
NNN
3001I
725NNN
3
e
ISN
0736
3
e
3
e
3
e

MCP3001-I/ST

Mfr. #:
Manufacturer:
Microchip Technology
Description:
Analog to Digital Converters - ADC 10-bit SPI Sgl Chl IND TEMP, TSSOP8
Lifecycle:
New from this manufacturer.
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